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Paper Abstract and Keywords
Presentation 2024-02-29 12:05

Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaki Okidono, Takuji Miki, Makoto Nagata (Kobe Univercity) VLD2023-112 HWS2023-72 ICD2023-101
Abstract (in Japanese) (See Japanese page) 
(in English) With the rapid development of electronic technology, the level of integration of electronic devices is clearly on the rise compared to previous years. While the high integration of semiconductors is being promoted, the accompanying thermal management problems are becoming more pronounced. To solve the overheating problem of electronic devices, it is necessary to study the thermal performance of electronic components, and the main research methods are thermo-fluid simulation and thermal experiments. In particular, thermo-fluid simulation of electronic components is very important to optimize the design, reduce stress due to thermal problems, and meet temperature requirements that guarantee quality. In this study, temperature measurements and thermo-fluid simulations of a semiconductor package were performed to evaluate and analyze the heat removal characteristics near the chip in a multi-chip assembly.
Keyword (in Japanese) (See Japanese page) 
(in English) Thermal exhaust characteristics / thermo-fluid simulation / multi-chip assembly / IC package / / / /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 392, ICD2023-101, pp. 77-82, Feb. 2024.
Paper # ICD2023-101 
Date of Issue 2024-02-21 (VLD, HWS, ICD) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF VLD2023-112 HWS2023-72 ICD2023-101

Conference Information
Committee VLD HWS ICD  
Conference Date 2024-02-28 - 2024-03-02 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To ICD 
Conference Code 2024-02-VLD-HWS-ICD 
Language Japanese without English title) 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English)  
Sub Title (in English)  
Keyword(1) Thermal exhaust characteristics  
Keyword(2) thermo-fluid simulation  
Keyword(3) multi-chip assembly  
Keyword(4) IC package  
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1st Author's Name Shuhei Yokota  
1st Author's Affiliation Kobe Univercity (Kobe Univercity)
2nd Author's Name Rikuu Hasegawa  
2nd Author's Affiliation Kobe Univercity (Kobe Univercity)
3rd Author's Name Kazuki Monta  
3rd Author's Affiliation Kobe Univercity (Kobe Univercity)
4th Author's Name Takaki Okidono  
4th Author's Affiliation Kobe Univercity (Kobe Univercity)
5th Author's Name Takuji Miki  
5th Author's Affiliation Kobe Univercity (Kobe Univercity)
6th Author's Name Makoto Nagata  
6th Author's Affiliation Kobe Univercity (Kobe Univercity)
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Speaker Author-1 
Date Time 2024-02-29 12:05:00 
Presentation Time 25 minutes 
Registration for ICD 
Paper # VLD2023-112, HWS2023-72, ICD2023-101 
Volume (vol) vol.123 
Number (no) no.390(VLD), no.391(HWS), no.392(ICD) 
Page pp.77-82 
#Pages 6 
Date of Issue 2024-02-21 (VLD, HWS, ICD) 

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