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| Presentation | 2024-02-29 10:35 Distributed Task Migration Algorithm for 3D Stacked Chips and Evaluation with actual measurement Takahiro Kanamori, Songxiang Wang, Kimiyoshi Usami (SIT)  VLD2023-109 HWS2023-69 ICD2023-98 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | The wireless communication technique between chips in a 3D stacked chip has a problem that certain areas are difficult to dissipate heat due to the absence of TSVs (Through Silicon Via). There are task transfer methods between processor cores on a chip as a thermal countermeasure, but existing centralized algorithms have a disadvantage that the larger the number of cores, the larger the computational overhead to find the optimal transfer. In this study, we developed an algorithm that can locally find the optimal move in a short time even with a large number of cores by using information only from adjacent cores while taking into account the heat dissipation capability of each location within the chip. The results of actual measurements on a prototype stacked chip showed that the proposed method was able to eliminate local high-temperature conditions without changing the total heat generation of the stacked chip. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | 3D-LSI / Dynamic Temperature Control / Task Migration / Thermal Management / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 123, no. 390, VLD2023-109, pp. 60-65, Feb. 2024. | |
| Paper # | VLD2023-109 | |
| Date of Issue | 2024-02-21 (VLD, HWS, ICD) | |
| ISSN | Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | VLD2023-109 HWS2023-69 ICD2023-98 |
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| Conference Information | |
| Committee | VLD HWS ICD |
| Conference Date | 2024-02-28 - 2024-03-02 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | VLD |
| Conference Code | 2024-02-VLD-HWS-ICD |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Distributed Task Migration Algorithm for 3D Stacked Chips and Evaluation with actual measurement |
| Sub Title (in English) | |
| Keyword(1) | 3D-LSI |
| Keyword(2) | Dynamic Temperature Control |
| Keyword(3) | Task Migration |
| Keyword(4) | Thermal Management |
| Keyword(5) | |
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| Keyword(8) | |
| 1st Author's Name | Takahiro Kanamori |
| 1st Author's Affiliation | Shibaura Institute of Technology (SIT) |
| 2nd Author's Name | Songxiang Wang |
| 2nd Author's Affiliation | Shibaura Institute of Technology (SIT) |
| 3rd Author's Name | Kimiyoshi Usami |
| 3rd Author's Affiliation | Shibaura Institute of Technology (SIT) |
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| Speaker | Author-1 |
| Date Time | 2024-02-29 10:35:00 |
| Presentation Time | 25 minutes |
| Registration for | VLD |
| Paper # | VLD2023-109, HWS2023-69, ICD2023-98 |
| Volume (vol) | vol.123 |
| Number (no) | no.390(VLD), no.391(HWS), no.392(ICD) |
| Page | pp.60-65 |
| #Pages | 6 |
| Date of Issue | 2024-02-21 (VLD, HWS, ICD) |
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