| Paper Abstract and Keywords |
| Presentation |
2024-06-06 13:25
[Invited Talk]
High-Speed EML and Assembly Techniques for Higher Edge Density Mizuki Shirao, Asami Uchiyama, Shinya Okuda, Toshiya Tsuji, Yohei Hokama, Kenichi Abe, Takuma Fujita, Nobuo Ohata (MELCO) OCS2024-13 |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
To increase the edge density of optical modules, increasing the serial transmission capacity and the number of arrayed components is essential. In this report, an ultra-high-speed EML and its assembling technique will be described to achieve higher edge density. A high-bandwidth EML submount is newly developed to support beyond 100 GBaud modulation, followed by a development of arrayed EML suitable for high-density packaging. In addition, the development status toward the 200 GBaud operation of EML will be reported. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
EML / / / / / / / |
| Reference Info. |
IEICE Tech. Rep., vol. 124, no. 65, OCS2024-13, pp. 23-28, June 2024. |
| Paper # |
OCS2024-13 |
| Date of Issue |
2024-05-30 (OCS) |
| ISSN |
Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
| Download PDF |
OCS2024-13 |
| Conference Information |
| Committee |
NS PN OCS |
| Conference Date |
2024-06-06 - 2024-06-07 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
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| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
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| Paper Information |
| Registration To |
OCS |
| Conference Code |
2024-06-NS-PN-OCS |
| Language |
Japanese |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
High-Speed EML and Assembly Techniques for Higher Edge Density |
| Sub Title (in English) |
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EML |
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| 1st Author's Name |
Mizuki Shirao |
| 1st Author's Affiliation |
Mitsubishi Electric Corp. (MELCO) |
| 2nd Author's Name |
Asami Uchiyama |
| 2nd Author's Affiliation |
Mitsubishi Electric Corp. (MELCO) |
| 3rd Author's Name |
Shinya Okuda |
| 3rd Author's Affiliation |
Mitsubishi Electric Corp. (MELCO) |
| 4th Author's Name |
Toshiya Tsuji |
| 4th Author's Affiliation |
Mitsubishi Electric Corp. (MELCO) |
| 5th Author's Name |
Yohei Hokama |
| 5th Author's Affiliation |
Mitsubishi Electric Corp. (MELCO) |
| 6th Author's Name |
Kenichi Abe |
| 6th Author's Affiliation |
Mitsubishi Electric Corp. (MELCO) |
| 7th Author's Name |
Takuma Fujita |
| 7th Author's Affiliation |
Mitsubishi Electric Corp. (MELCO) |
| 8th Author's Name |
Nobuo Ohata |
| 8th Author's Affiliation |
Mitsubishi Electric Corp. (MELCO) |
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| Speaker |
Author-1 |
| Date Time |
2024-06-06 13:25:00 |
| Presentation Time |
45 minutes |
| Registration for |
OCS |
| Paper # |
OCS2024-13 |
| Volume (vol) |
vol.124 |
| Number (no) |
no.65 |
| Page |
pp.23-28 |
| #Pages |
6 |
| Date of Issue |
2024-05-30 (OCS) |