Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2024-08-01 15:25
Estimation of Electromechanical Coupling Coefficient from HBAR Using Multiple Echo Integration and Ratio of Dielectric Constant
Yohkoh Shimano, Kohei Ekida, Takahiko Yanagitani (Waseda Univ.) US2024-24
Abstract (in Japanese) (See Japanese page) 
(in English) IEEE standard recommends the resonance-antiresonance method for the estimation of electromechanical coupling coefficient k2 using FBAR, which require substrate removal. In this study, we propose two new methods for extracting k2 without substrate removal, named “Multiple echo integration method” and “Dielectric constant ratio method”. Multiple echo integration method can estimate effective electromechanical coupling coefficient keff2 including electrode effects by producing pseudo FBAR free-standing structure. In contrast, Dielectric constant ratio method can evaluate intrinsic k332 using the ratio of dielectric constant εT in the lower frequency range and εS in the higher frequency range.
Keyword (in Japanese) (See Japanese page) 
(in English) Piezoelectric thin film / Electromechanical coupling coefficient / Multiple echo integration method / Dielectric constant ratio method / ScAlN / / /  
Reference Info. IEICE Tech. Rep., vol. 124, no. 141, US2024-24, pp. 37-42, Aug. 2024.
Paper # US2024-24 
Date of Issue 2024-07-25 (US) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF US2024-24

Conference Information
Committee US  
Conference Date 2024-08-01 - 2024-08-02 
Place (in Japanese) (See Japanese page) 
Place (in English) Matsue Terrsa 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Material characterization, Ultrasonics, etc. 
Paper Information
Registration To US 
Conference Code 2024-08-US 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Estimation of Electromechanical Coupling Coefficient from HBAR Using Multiple Echo Integration and Ratio of Dielectric Constant 
Sub Title (in English)  
Keyword(1) Piezoelectric thin film  
Keyword(2) Electromechanical coupling coefficient  
Keyword(3) Multiple echo integration method  
Keyword(4) Dielectric constant ratio method  
Keyword(5) ScAlN  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Yohkoh Shimano  
1st Author's Affiliation Waseda University (Waseda Univ.)
2nd Author's Name Kohei Ekida  
2nd Author's Affiliation Waseda University (Waseda Univ.)
3rd Author's Name Takahiko Yanagitani  
3rd Author's Affiliation Waseda University (Waseda Univ.)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2024-08-01 15:25:00 
Presentation Time 25 minutes 
Registration for US 
Paper # US2024-24 
Volume (vol) vol.124 
Number (no) no.141 
Page pp.37-42 
#Pages 6 
Date of Issue 2024-07-25 (US) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan