Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2024-08-30 12:40
[Invited Talk] Trends in Advanced LSI Interconnect Technology and Applications of Graphene
Kazuyoshi Ueno (SIT) R2024-24 EMD2024-18 CPM2024-34 OPE2024-74 LQE2024-21
Abstract (in Japanese) (See Japanese page) 
(in English) For LSI interconnects beyond the 2nm-node, where the minimum interconnect width will be 10nm or less, the problems of increased resistance and degradation of electromigration (EM) reliability of the currently used copper (Cu) interconnects have led to the use of technology to extend the Cu interconnects or ruthenium (Ru), an alternative material to Cu. Research and development of new material technology such as Ru is being carried out in parallel. In this paper, I will outline this trend and introduce our research on the application of graphene to interconnects and RF devices.
Keyword (in Japanese) (See Japanese page) 
(in English) Integrated Circuit / Interconnect / Multilayer graphene / RF Device / / / /  
Reference Info. IEICE Tech. Rep., vol. 124, no. 167, R2024-24, pp. 55-60, Aug. 2024.
Paper # R2024-24 
Date of Issue 2024-08-22 (R, EMD, CPM, OPE, LQE) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2024-24 EMD2024-18 CPM2024-34 OPE2024-74 LQE2024-21

Conference Information
Committee CPM LQE OPE EMD R  
Conference Date 2024-08-29 - 2024-08-30 
Place (in Japanese) (See Japanese page) 
Place (in English) Hirosaki University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Photodetectors, Modulators, Optical Electrical device packaging and reliability 
Paper Information
Registration To R 
Conference Code 2024-08-CPM-LQE-OPE-EMD-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Trends in Advanced LSI Interconnect Technology and Applications of Graphene 
Sub Title (in English)  
Keyword(1) Integrated Circuit  
Keyword(2) Interconnect  
Keyword(3) Multilayer graphene  
Keyword(4) RF Device  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Kazuyoshi Ueno  
1st Author's Affiliation Shibaura Institute of Technology (SIT)
2nd Author's Name  
2nd Author's Affiliation ()
3rd Author's Name  
3rd Author's Affiliation ()
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2024-08-30 12:40:00 
Presentation Time 60 minutes 
Registration for R 
Paper # R2024-24, EMD2024-18, CPM2024-34, OPE2024-74, LQE2024-21 
Volume (vol) vol.124 
Number (no) no.167(R), no.168(EMD), no.169(CPM), no.170(OPE), no.171(LQE) 
Page pp.55-60 
#Pages 6 
Date of Issue 2024-08-22 (R, EMD, CPM, OPE, LQE) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan