Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2024-11-14 11:20
Impact of Size Effect on Delay Time of On-Chip Interconnects under Cryogenic Conditions
Tatsuya Ueda, Akira Tsuchiya, Toshiyuki Inoue, Keiji Kishine (Univ Shiga Prefecture) VLD2024-70 ICD2024-88 DC2024-92 RECONF2024-100
Abstract (in Japanese) (See Japanese page) 
(in English) In a quantum computer, it is expected that the control function of qubits will be integrated into an integrated circuit and operated in cryogenic environment.
In general, as the temperature decreases, the wire resistance decreases , and the delay time also decreases accordingly.
At cryogenic environment, mean free path of electrons become longer.
The decrease in wire resistance becomes slower due to the size effect.
The signal propagation delay is contains the gate delay and interconnect delay.
If the wire resistance is sufficiently small, the gate delay is dominant.
However, under cryogenic condition, the size effect causes error in the estimation of interconnct delay.
It is not clear at what level of wire length the impact of size effect on interconnect delay becomes significant.
In this paper, we evaluate the wire length at which the influence of size effect on interconnect delay under cryogenic condition becomes non-negligible.
Compared to the case where wire resistance is based on the RRR, we found that there is a 10% error in delay time when the wiring length is 123 $mu$m, and there is an 80.7% error when the wiring length is 1000 $mu$m.
Keyword (in Japanese) (See Japanese page) 
(in English) Cryogenic / Size effect / delay / / / / /  
Reference Info. IEICE Tech. Rep., vol. 124, no. 248, ICD2024-88, pp. 243-246, Nov. 2024.
Paper # ICD2024-88 
Date of Issue 2024-11-05 (VLD, ICD, DC, RECONF) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF VLD2024-70 ICD2024-88 DC2024-92 RECONF2024-100

Conference Information
Committee VLD DC RECONF ICD IPSJ-SLDM  
Conference Date 2024-11-12 - 2024-11-14 
Place (in Japanese) (See Japanese page) 
Place (in English) COMPAL HALL 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Design Gaia 2024 -New Field of VLSI Design- 
Paper Information
Registration To ICD 
Conference Code 2024-11-VLD-DC-RECONF-ICD-SLDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Impact of Size Effect on Delay Time of On-Chip Interconnects under Cryogenic Conditions 
Sub Title (in English)  
Keyword(1) Cryogenic  
Keyword(2) Size effect  
Keyword(3) delay  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Tatsuya Ueda  
1st Author's Affiliation University of Shiga Prefecture (Univ Shiga Prefecture)
2nd Author's Name Akira Tsuchiya  
2nd Author's Affiliation University of Shiga Prefecture (Univ Shiga Prefecture)
3rd Author's Name Toshiyuki Inoue  
3rd Author's Affiliation University of Shiga Prefecture (Univ Shiga Prefecture)
4th Author's Name Keiji Kishine  
4th Author's Affiliation University of Shiga Prefecture (Univ Shiga Prefecture)
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2024-11-14 11:20:00 
Presentation Time 25 minutes 
Registration for ICD 
Paper # VLD2024-70, ICD2024-88, DC2024-92, RECONF2024-100 
Volume (vol) vol.124 
Number (no) no.247(VLD), no.248(ICD), no.249(DC), no.250(RECONF) 
Page pp.243-246 
#Pages
Date of Issue 2024-11-05 (VLD, ICD, DC, RECONF) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan