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Paper Abstract and Keywords
Presentation 2025-02-19 16:10
[Invited Talk] Study on High Thermal Conductivity AlN Films for 3D Chiplets with Excellent Heat Dissipation
Takeshi Takagi, Takeki Ninomiya, Masaaki Niwa, Soken Obara, Takeshi Momose, Yukihiro Shimogaki, Masahiro Nomura, Hiroshi Fujioka (UTokyo), Masakazu Mori (Ryukoku U.), Tadahiro Kuroda (UTokyo) SDM2024-78
Abstract (in Japanese) (See Japanese page) 
(in English) A novel “Cool 3D chiplet” concept is proposed, showcasing remarkable heat dissipation through the integration of aluminum nitride (AlN), an insulating material with high thermal conductivity. We conducted simulations analyzing the thermal impact of AlN as an interlayer dielectric (ILD) for the back-side power delivery network (BSPDN), a TSV insulating film, and a molding material for the packaging. Furthermore, we explored appropriate AlN deposition techniques for each application. The results demonstrate the feasibility of building advanced 3D chiplets with enhanced heat dissipation by employing the AlN in each layer that makes up the 3D chiplet, from the device level to the packaging level.
Keyword (in Japanese) (See Japanese page) 
(in English) 3DIC / BSPDN / TSV / Chiplet / AlN / Heat Dissipation / /  
Reference Info. IEICE Tech. Rep., vol. 124, no. 376, SDM2024-78, pp. 23-26, Feb. 2025.
Paper # SDM2024-78 
Date of Issue 2025-02-12 (SDM) 
ISSN Online edition: ISSN 2432-6380
Copyright
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reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee SDM  
Conference Date 2025-02-19 - 2025-02-19 
Place (in Japanese) (See Japanese page) 
Place (in English) Tokyo Univ. Hongo Engineering/Building4-Room43 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2025-02-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Study on High Thermal Conductivity AlN Films for 3D Chiplets with Excellent Heat Dissipation 
Sub Title (in English)  
Keyword(1) 3DIC  
Keyword(2) BSPDN  
Keyword(3) TSV  
Keyword(4) Chiplet  
Keyword(5) AlN  
Keyword(6) Heat Dissipation  
Keyword(7)  
Keyword(8)  
1st Author's Name Takeshi Takagi  
1st Author's Affiliation The University of Tokyo (UTokyo)
2nd Author's Name Takeki Ninomiya  
2nd Author's Affiliation The University of Tokyo (UTokyo)
3rd Author's Name Masaaki Niwa  
3rd Author's Affiliation The University of Tokyo (UTokyo)
4th Author's Name Soken Obara  
4th Author's Affiliation The University of Tokyo (UTokyo)
5th Author's Name Takeshi Momose  
5th Author's Affiliation The University of Tokyo (UTokyo)
6th Author's Name Yukihiro Shimogaki  
6th Author's Affiliation The University of Tokyo (UTokyo)
7th Author's Name Masahiro Nomura  
7th Author's Affiliation The University of Tokyo (UTokyo)
8th Author's Name Hiroshi Fujioka  
8th Author's Affiliation The University of Tokyo (UTokyo)
9th Author's Name Masakazu Mori  
9th Author's Affiliation Ryukoku University (Ryukoku U.)
10th Author's Name Tadahiro Kuroda  
10th Author's Affiliation The University of Tokyo (UTokyo)
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Speaker Author-1 
Date Time 2025-02-19 16:10:00 
Presentation Time 40 minutes 
Registration for SDM 
Paper # SDM2024-78 
Volume (vol) vol.124 
Number (no) no.376 
Page pp.23-26 
#Pages 4 
Date of Issue 2025-02-12 (SDM) 

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