Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2025-11-14 16:40
Evaluation of digital circuit characteristic variations caused by intentional backside voltage application in flip-chip devices
Shuhei Yokota, Rikuu Hasegawa, Takuya Wadatsumi, Kazuki Monta (Kobe Univ.), Junichi Sakamoto, Shinichi Kawamura (AIST), Makoto Nagata (Kobe Univ.) HWS2025-70 ICD2025-35
Abstract (in Japanese) (See Japanese page) 
(in English) In recent years, flip-chip packaging, a technique in which IC chips are flipped and directly mounted onto the
substrate, has become the mainstream approach. While flip-chip implementation offers the advantage of achieving higher
integration density, it also has the potential drawback that the exposed backside of the Si chip is susceptible to various disturbance.
In this study, we explore the effects of backside disturbances in a cascaded inverter structure and exploit several techniques to
evaluate the variation of digital circuit characteristics .
Keyword (in Japanese) (See Japanese page) 
(in English) Cascaded inverter / Flip-chip / Backside biasing / / / / /  
Reference Info. IEICE Tech. Rep., vol. 125, no. 249, ICD2025-35, pp. 45-47, Nov. 2025.
Paper # ICD2025-35 
Date of Issue 2025-11-07 (HWS, ICD) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF HWS2025-70 ICD2025-35

Conference Information
Committee ICD HWS  
Conference Date 2025-11-14 - 2025-11-14 
Place (in Japanese) (See Japanese page) 
Place (in English) Kumamoto University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Hardware Security, etc. 
Paper Information
Registration To ICD 
Conference Code 2025-11-ICD-HWS 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Evaluation of digital circuit characteristic variations caused by intentional backside voltage application in flip-chip devices 
Sub Title (in English)  
Keyword(1) Cascaded inverter  
Keyword(2) Flip-chip  
Keyword(3) Backside biasing  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Shuhei Yokota  
1st Author's Affiliation Kobe University (Kobe Univ.)
2nd Author's Name Rikuu Hasegawa  
2nd Author's Affiliation Kobe University (Kobe Univ.)
3rd Author's Name Takuya Wadatsumi  
3rd Author's Affiliation Kobe University (Kobe Univ.)
4th Author's Name Kazuki Monta  
4th Author's Affiliation Kobe University (Kobe Univ.)
5th Author's Name Junichi Sakamoto  
5th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
6th Author's Name Shinichi Kawamura  
6th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
7th Author's Name Makoto Nagata  
7th Author's Affiliation Kobe University (Kobe Univ.)
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2025-11-14 16:40:00 
Presentation Time 25 minutes 
Registration for ICD 
Paper # HWS2025-70, ICD2025-35 
Volume (vol) vol.125 
Number (no) no.248(HWS), no.249(ICD) 
Page pp.45-47 
#Pages 3 
Date of Issue 2025-11-07 (HWS, ICD) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan