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Paper Abstract and Keywords
Presentation 2025-11-14 13:20
[Invited Talk] SISPAD2025 Review
Satofumi Souma (Kobe Univ) SDM2025-61
Abstract (in Japanese) (See Japanese page) 
(in English) International Conference on Simulation of Semiconductor Processes and Devices 2025 (SISPAD 2025)
was held on September 23 -- 26 in Grenoble (France).
In this report, will review several papers presented at the conference in detail as well as discuss the overall trends of
the technological topics included in this year's program.
Keyword (in Japanese) (See Japanese page) 
(in English) SISPAD2025 / review / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 125, no. 246, SDM2025-61, pp. 34-39, Nov. 2025.
Paper # SDM2025-61 
Date of Issue 2025-11-06 (SDM) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2025-61

Conference Information
Committee SDM  
Conference Date 2025-11-13 - 2025-11-14 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process, Device, Circuit simulation, etc. 
Paper Information
Registration To SDM 
Conference Code 2025-11-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) SISPAD2025 Review 
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Keyword(1) SISPAD2025  
Keyword(2) review  
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1st Author's Name Satofumi Souma  
1st Author's Affiliation Kobe University (Kobe Univ)
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Speaker Author-1 
Date Time 2025-11-14 13:20:00 
Presentation Time 50 minutes 
Registration for SDM 
Paper # SDM2025-61 
Volume (vol) vol.125 
Number (no) no.246 
Page pp.34-39 
#Pages 6 
Date of Issue 2025-11-06 (SDM) 

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