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Paper Abstract and Keywords
Presentation 2025-11-20 13:40
Thermally Robust 3C-SiC/Diamond and Si (111)/Diamond Templates for Advanced III-Nitride Process
Hikaru Iwamoto (Osaka Metropolitan Univ.), Yutaka Ohno (Tohoku Univ.), Jianbo Liang, Naoteru Shigekawa (Osaka Metropolitan Univ.) ED2025-27 CPM2025-55 LQE2025-51
Abstract (in Japanese) (See Japanese page) 
(in English) 3C-SiC/diamond and Si (111)/diamond templates were fabricated using surface-activated bonding and their thermal stabilities were investigated by annealing them at temperatures up to 1300 °C. The 3C-SiC/diamond template retained structural integrity for the annealing temperatures up to 1100 °C, but exhibited significant delamination after the annealing at 1300 °C. In contrast, the Si (111)/diamond template maintained a large bonding area and structural stability regardless of the annealing temperature. These results demonstrate that both templates are compatible with high-temperature nitride processes and the Si (111)/diamond template exhibit superior thermal stability.
Keyword (in Japanese) (See Japanese page) 
(in English) surface-activated-bonding (SAB) / 3C-SiC/diamond / Si (111)/diamond / thermal stability / residual stress / / /  
Reference Info. IEICE Tech. Rep., vol. 125, no. 257, ED2025-27, pp. 17-20, Nov. 2025.
Paper # ED2025-27 
Date of Issue 2025-11-13 (ED, CPM, LQE) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ED2025-27 CPM2025-55 LQE2025-51

Conference Information
Committee CPM ED LQE  
Conference Date 2025-11-20 - 2025-11-21 
Place (in Japanese) (See Japanese page) 
Place (in English) TENMONKAN VISION HALL 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To ED 
Conference Code 2025-11-CPM-ED-LQE 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Thermally Robust 3C-SiC/Diamond and Si (111)/Diamond Templates for Advanced III-Nitride Process 
Sub Title (in English)  
Keyword(1) surface-activated-bonding (SAB)  
Keyword(2) 3C-SiC/diamond  
Keyword(3) Si (111)/diamond  
Keyword(4) thermal stability  
Keyword(5) residual stress  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Hikaru Iwamoto  
1st Author's Affiliation Osaka Metropolitan University (Osaka Metropolitan Univ.)
2nd Author's Name Yutaka Ohno  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
3rd Author's Name Jianbo Liang  
3rd Author's Affiliation Osaka Metropolitan University (Osaka Metropolitan Univ.)
4th Author's Name Naoteru Shigekawa  
4th Author's Affiliation Osaka Metropolitan University (Osaka Metropolitan Univ.)
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Speaker Author-1 
Date Time 2025-11-20 13:40:00 
Presentation Time 25 minutes 
Registration for ED 
Paper # ED2025-27, CPM2025-55, LQE2025-51 
Volume (vol) vol.125 
Number (no) no.257(ED), no.258(CPM), no.259(LQE) 
Page pp.17-20 
#Pages 4 
Date of Issue 2025-11-13 (ED, CPM, LQE) 

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