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Paper Abstract and Keywords
Presentation 2026-03-13 14:35
[Invited Talk] Transformation From 2D Shuttle Chips to 3D-IC -- Via-last TSV Formation/Heterogeneous 3D Integration with Photosensitive Temporary Adhesives --
Akihiro Tominaga, Jiayi Shen, Takafumi Fukushima (Tohoku University) SDM2025-75
Abstract (in Japanese) (See Japanese page) 
(in English) Access to agile prototyping of 3D-IC with Through-Silicon Vias (TSVs) is highly restricted to a limited number of Integrated Device Manufacturers (IDMs), leaving extremely few opportunities for proof-of-concept at the R&D level. We have previously demonstrated die-level 3D-IC fabrication using the TSVs and 3D stacking with heterogeneous devices; however, several challenges remain. This paper introduces recent advances in agile prototyping technology that transforms 2D-ICs into 3D-ICs. By leveraging Multi-Project Wafers (MPWs), this approach enables the seamless conversion of 2D shuttle chips into advanced 3D -IC with photosensitive temporary adhesives.
Keyword (in Japanese) (See Japanese page) 
(in English) 3D-IC/TSV / Agile Prototyping / TBTD / Heterogeneous Integration / Chip-to-Wafer / / /  
Reference Info. IEICE Tech. Rep., vol. 125, no. 399, SDM2025-75, pp. 12-15, March 2026.
Paper # SDM2025-75 
Date of Issue 2026-03-06 (SDM) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2025-75

Conference Information
Committee SDM  
Conference Date 2026-03-13 - 2026-03-13 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2026-03-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Transformation From 2D Shuttle Chips to 3D-IC 
Sub Title (in English) Via-last TSV Formation/Heterogeneous 3D Integration with Photosensitive Temporary Adhesives 
Keyword(1) 3D-IC/TSV  
Keyword(2) Agile Prototyping  
Keyword(3) TBTD  
Keyword(4) Heterogeneous Integration  
Keyword(5) Chip-to-Wafer  
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1st Author's Name Akihiro Tominaga  
1st Author's Affiliation Tohoku University (Tohoku University)
2nd Author's Name Jiayi Shen  
2nd Author's Affiliation Tohoku University (Tohoku University)
3rd Author's Name Takafumi Fukushima  
3rd Author's Affiliation Tohoku University (Tohoku University)
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Speaker Author-3 
Date Time 2026-03-13 14:35:00 
Presentation Time 40 minutes 
Registration for SDM 
Paper # SDM2025-75 
Volume (vol) vol.125 
Number (no) no.399 
Page pp.12-15 
#Pages 4 
Date of Issue 2026-03-06 (SDM) 

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