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Paper Abstract and Keywords
Presentation 2026-03-13 16:05
[Invited Talk] Fabrication of Panel-Level Redistribution Interposer With L/S=1.5/1.5 μm Multilayer Fine Wiring and Solutions to Issues of Miniaturization
Masashi Minami, Sachiko Matsushita, Sadaaki Katoh (Resonac) SDM2025-77
Abstract (in Japanese) (See Japanese page) 
(in English) The advancement of generative AI and the widespread adoption of high-speed networking systems have increased the demand for high-performance semiconductor packages. In this study, we conducted panel-level assembly evaluations of organic interposers for 2.xD packages and successfully fabricated multilayer RDL structures with L/S = 1.5/1.5 μm fine wiring using the Semi-Additive Process (SAP). Countermeasures were implemented to address lithography margins, surface topography, and etching residues associated with wiring miniaturization, and the resistance distribution and reliability of the wiring were evaluated. Furthermore, the effectiveness of damascene wiring in improving dimensional stability was confirmed.
Keyword (in Japanese) (See Japanese page) 
(in English) 2.xD semiconductor packages / organic interposer / panel-level interposer / fine wirings / / / /  
Reference Info. IEICE Tech. Rep., vol. 125, no. 399, SDM2025-77, pp. 20-23, March 2026.
Paper # SDM2025-77 
Date of Issue 2026-03-06 (SDM) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2025-77

Conference Information
Committee SDM  
Conference Date 2026-03-13 - 2026-03-13 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2026-03-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Fabrication of Panel-Level Redistribution Interposer With L/S=1.5/1.5 μm Multilayer Fine Wiring and Solutions to Issues of Miniaturization 
Sub Title (in English)  
Keyword(1) 2.xD semiconductor packages  
Keyword(2) organic interposer  
Keyword(3) panel-level interposer  
Keyword(4) fine wirings  
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1st Author's Name Masashi Minami  
1st Author's Affiliation Resonac Corporation (Resonac)
2nd Author's Name Sachiko Matsushita  
2nd Author's Affiliation Resonac Corporation (Resonac)
3rd Author's Name Sadaaki Katoh  
3rd Author's Affiliation Resonac Corporation (Resonac)
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Speaker Author-1 
Date Time 2026-03-13 16:05:00 
Presentation Time 40 minutes 
Registration for SDM 
Paper # SDM2025-77 
Volume (vol) vol.125 
Number (no) no.399 
Page pp.20-23 
#Pages 4 
Date of Issue 2026-03-06 (SDM) 

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