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Paper Abstract and Keywords
Presentation 2026-06-05 16:25
[Invited Lecture] Millimeter-Wave and Terahertz Wireless Communication Module Technologies toward 6G and Beyond 5G
Yosuke Sato, Natsumi Minamitani, Kazushige Sato, Hisao Hayafuji (Murata Manufacturing) SRW2026-17 MWPTHz2026-17
Abstract (in Japanese) (See Japanese page) 
(in English) In Beyond 5G/6G, broadband millimeter-wave and terahertz-wave bands are expected to support increasing traffic demand, high-throughput and low-latency applications. However, higher frequencies lead to greater transmission loss, making antenna array integrated modules (AiM), which shorten the interconnection between the RFIC and antenna, essential. This presentation introduces AiM configurations and development examples for user equipment, base stations, and backhaul applications, focusing on packaging technologies that reduce loss and transmit power through beamforming. It also discusses AiM design for the 140 GHz band, including the need for compound semiconductors, heterogeneous integration with CMOS, chiplets, CSPs, and three-dimensional packaging. Finally, multilayer substrate materials such as PCB and LTCC are compared, and transmission loss evaluation results up to 200 GHz are presented to clarify challenges toward communication modules above 100 GHz.
Keyword (in Japanese) (See Japanese page) 
(in English) Millimeter-wave communication / Sub-THz Communication / THz Communication / AiM / Packaging / / /  
Reference Info. IEICE Tech. Rep., vol. 126, no. 55, SRW2026-17, pp. 71-71, June 2026.
Paper # SRW2026-17 
Date of Issue 2026-05-28 (SRW, MWPTHz) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SRW2026-17 MWPTHz2026-17

Conference Information
Committee SRW MWPTHz  
Conference Date 2026-06-04 - 2026-06-05 
Place (in Japanese) (See Japanese page) 
Place (in English) NICT Innovation center 
Topics (in Japanese) (See Japanese page) 
Topics (in English) MWPTHz, WLAN, WPAN, Ad-hoc, mmWave, THz, etc. 
Paper Information
Registration To SRW 
Conference Code 2026-06-SRW-MWPTHz 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Millimeter-Wave and Terahertz Wireless Communication Module Technologies toward 6G and Beyond 5G 
Sub Title (in English)  
Keyword(1) Millimeter-wave communication  
Keyword(2) Sub-THz Communication  
Keyword(3) THz Communication  
Keyword(4) AiM  
Keyword(5) Packaging  
Keyword(6)  
Keyword(7)  
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1st Author's Name Yosuke Sato  
1st Author's Affiliation Murata Manufacturing Co., Ltd. (Murata Manufacturing)
2nd Author's Name Natsumi Minamitani  
2nd Author's Affiliation Murata Manufacturing Co., Ltd. (Murata Manufacturing)
3rd Author's Name Kazushige Sato  
3rd Author's Affiliation Murata Manufacturing Co., Ltd. (Murata Manufacturing)
4th Author's Name Hisao Hayafuji  
4th Author's Affiliation Murata Manufacturing Co., Ltd. (Murata Manufacturing)
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Speaker Author-1 
Date Time 2026-06-05 16:25:00 
Presentation Time 25 minutes 
Registration for SRW 
Paper # SRW2026-17, MWPTHz2026-17 
Volume (vol) vol.126 
Number (no) no.55(SRW), no.56(MWPTHz) 
Page p.71 
#Pages 1 
Date of Issue 2026-05-28 (SRW, MWPTHz) 

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