Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings[Type 1 Only]
NOTICE: Due to an emergency maintenance from Oct. 22, 2026, some system functions are currently restricted. Manuscript uploads are unavailable from October 26 through October 30. For speakers whose manuscript submission deadline within this period, we will provide individual guidance on how to upload. We apologize for the inconvenience.
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2026-06-18 13:05
[Invited Talk] Impact of back-end-of-line processing on the performance of InP-HEMT
Taro Sasaki, Hiroki Sugiyama, Yuki Yoshiya, Takuya Hoshi, Yasuyuki Miyamoto, Hiroshi Hamada, Ibrahim Abdo, Fumito Nakajima (NTT) MW2026-22
Abstract (in Japanese) (See Japanese page) 
(in English) In this presentation, our 60-nm-gate InP-HEMT technology for high-speed MMICs are introduced. We also present recent findings regarding process technology, focusing on transistor degradation observed during BEOL processing and methods for suppressing this degradation. TEM observations and EDX mappings of degraded transistors revealed that the surface passivation effect of the InP recess-etching stopper was deteriorated. To mitigate this damage, the recess-etching time was shortened, corresponding to a reduction in recess length. As a result, reducing the target recess length from 150 nm to 100 nm was found to effectively suppress the degradation.
Keyword (in Japanese) (See Japanese page) 
(in English) InP / HEMT / 300 GHz band / MMIC / / / /  
Reference Info. IEICE Tech. Rep., vol. 126, no. 78, MW2026-22, pp. 1-6, June 2026.
Paper # MW2026-22 
Date of Issue 2026-06-11 (MW) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF MW2026-22

Conference Information
Committee MW  
Conference Date 2026-06-18 - 2026-06-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave 
Paper Information
Registration To MW 
Conference Code 2026-06-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Impact of back-end-of-line processing on the performance of InP-HEMT 
Sub Title (in English)  
Keyword(1) InP  
Keyword(2) HEMT  
Keyword(3) 300 GHz band  
Keyword(4) MMIC  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Taro Sasaki  
1st Author's Affiliation Device Technology Labs., NTT, Inc. (NTT)
2nd Author's Name Hiroki Sugiyama  
2nd Author's Affiliation Device Technology Labs., NTT, Inc. (NTT)
3rd Author's Name Yuki Yoshiya  
3rd Author's Affiliation Device Technology Labs., NTT, Inc. (NTT)
4th Author's Name Takuya Hoshi  
4th Author's Affiliation Device Technology Labs., NTT, Inc. (NTT)
5th Author's Name Yasuyuki Miyamoto  
5th Author's Affiliation Device Technology Labs., NTT, Inc. (NTT)
6th Author's Name Hiroshi Hamada  
6th Author's Affiliation Device Technology Labs., NTT, Inc. (NTT)
7th Author's Name Ibrahim Abdo  
7th Author's Affiliation Device Technology Labs., NTT, Inc. (NTT)
8th Author's Name Fumito Nakajima  
8th Author's Affiliation Device Technology Labs., NTT, Inc. (NTT)
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2026-06-18 13:05:00 
Presentation Time 45 minutes 
Registration for MW 
Paper # MW2026-22 
Volume (vol) vol.126 
Number (no) no.78 
Page pp.1-6 
#Pages 6 
Date of Issue 2026-06-11 (MW) 

[Return to Top Page]

[Return to IEICE Web Page]

(Line Height for English Pages: 1)
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan