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Paper Abstract and Keywords
Presentation 2026-08-05 13:10
[Invited Talk] 3D Orthogonal Die Stacking Technology for DRAM-on-GPU Integration Using Contactless Die-to-Die Interface
Yuki Mitarai, Hung-Chih Huang, Mototsugu Hamada, Atsutake Kosuge (UTokyo) SDM2026-30 ICD2026-20
Abstract (in Japanese) (See Japanese page) 
(in English) With the advancement of generative AI, overcoming the memory wall has become a critical challenge, and three-dimensional stacking of memory and processors has attracted attention. Based on the Massive Orthogonal Stacking Assembly of IC (MOSAIC), this work proposes a memory-on-GPU integration in which memory dies are stacked orthogonally onto the GPU. To address the heat-dissipation challenge in 3D stacking, a high-thermal-conductivity silicon substrate is placed vertically, suppressing the peak temperature. This work further presents an example application of a contactless proximity inductive-coupling interface that enables die-to-die communication while avoiding the bonding difficulties associated with orthogonal stacking.
Keyword (in Japanese) (See Japanese page) 
(in English) 3D integration / orthogonal stacking / DRAM-on-GPU / inductive coupling / / / /  
Reference Info. IEICE Tech. Rep., vol. 126, no. 137, SDM2026-30, pp. 34-39, Aug. 2026.
Paper # SDM2026-30 
Date of Issue 2026-07-28 (SDM, ICD) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2026-30 ICD2026-20

Conference Information
Committee ICD SDM ITE-IST  
Conference Date 2026-08-04 - 2026-08-06 
Place (in Japanese) (See Japanese page) 
Place (in English) Hokkaido Univ, School of Science 2nd Bldg. Room2-507 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Analog, Mixed Analog and Digital, RF, and Sensor Interface, Low Voltage/Low Power Techniques, Novel Devices/Circuits, and the Applications 
Paper Information
Registration To SDM 
Conference Code 2026-08-ICD-SDM-IST 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) 3D Orthogonal Die Stacking Technology for DRAM-on-GPU Integration Using Contactless Die-to-Die Interface 
Sub Title (in English)  
Keyword(1) 3D integration  
Keyword(2) orthogonal stacking  
Keyword(3) DRAM-on-GPU  
Keyword(4) inductive coupling  
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1st Author's Name Yuki Mitarai  
1st Author's Affiliation The Univiersity of Tokyo (UTokyo)
2nd Author's Name Hung-Chih Huang  
2nd Author's Affiliation The Univiersity of Tokyo (UTokyo)
3rd Author's Name Mototsugu Hamada  
3rd Author's Affiliation The Univiersity of Tokyo (UTokyo)
4th Author's Name Atsutake Kosuge  
4th Author's Affiliation The Univiersity of Tokyo (UTokyo)
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Speaker Author-1 
Date Time 2026-08-05 13:10:00 
Presentation Time 45 minutes 
Registration for SDM 
Paper # SDM2026-30, ICD2026-20 
Volume (vol) vol.126 
Number (no) no.137(SDM), no.138(ICD) 
Page pp.34-39 
#Pages 6 
Date of Issue 2026-07-28 (SDM, ICD) 

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