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Technical Committee on Silicon Device and Materials (SDM) (Searched in: 2022)
Search Results: Keywords 'from:2023-02-07 to:2023-02-07'
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| SDM | 2023-02-07 10:05 |
Tokyo | Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects Koichi Motoyama (IBM)  SDM2022-85 |
[more] | SDM2022-85 pp.1-4 |
| SDM | 2023-02-07 10:45 |
Tokyo | Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
Atomic Layer and Conformal Etching Technologies of 3D Structures in Advanced Logic and Memory Devices Hiroto Ohtake (Hitachi High-Tech Corp.) SDM2022-86 |
Isotropic atomic layer etching (ALE) has become essential technology for the fabrication of logic transistors beyond 2nm... [more] | SDM2022-86 pp.5-8 |
| SDM | 2023-02-07 11:25 |
Tokyo | Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
Advanced process technologies for continuous logic scaling towards 2nm node and beyond Tomonari Yamamoto (TEL) SDM2022-87 |
[more] | SDM2022-87 pp.9-12 |
| SDM | 2023-02-07 13:20 |
Tokyo | Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
Pixel Pitch Hybrid Bonding and Three Layer Stacking Technology for BSI Kazumasa Tanida, Shigeru Suzuki, Toshiki Seo, Yasunori Morinaga, Hayato Korogi, Michinari Tetani, Masakazu Hamada, Ryuji Eto, Takeshi Yamashita, Yasuhiro Kato, Naoaki Sato, Tadami Shimizu, Tetsuro Hanawa, Hiroko Kubo, Fumitaka Ito, Yoshihiro Noguchi, Masayuki Nakamura, Ryuji Mizukoshi, Masahiko Takeuchi, Masakatsu Suzuki, Naoto Niisoe, Isao Miyanaga, Atsushi Ikeda, Susumu Matsumoto (TPSCo) SDM2022-88 |
(To be available after the conference date) [more] | SDM2022-88 pp.13-16 |
| SDM | 2023-02-07 14:00 |
Tokyo | Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
Applications of the surface activated bonding on heterogeneous Integration at room temperature Tadatomo Suga (Meisei Univ.) SDM2022-89 |
The potential application of surface-activated junction (SAB) to semiconductor 3D hetero-integration is presented. In pa... [more] | SDM2022-89 pp.17-22 |
| SDM | 2023-02-07 14:40 |
Tokyo | Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
New Approach for Epoxy Mold Compound Slurry in Advanced Packaging Technology Shogo Arata, Chiaki Noda, Yasuhiro Ichige, Satoyuki Nomura (Resonac), Trianggono Widodo, Nagatoshi Tsunoda, Xavier Brun (Intel) SDM2022-90 |
Chemical mechanical polishing (CMP) process has been a part of semiconductor manufacturing processes from front-end to b... [more] | SDM2022-90 pp.23-26 |
| SDM | 2023-02-07 15:35 |
Tokyo | Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
Temperature Dependence of Information Processing Performance of Ionic Liquid Type Intelligent Connection Device Masakazu Kobayashi (NAGASE), Hisashi Shima, Yasuhisa Naitoh, Hiroyuki Akinaga (AIST), Dan Sato, Takuma Matsuo, Masaharu Yonezawa, Kentaro Kinoshita (TUS), Toshiyuki Itoh (Toyota Phys. & Chem. Res. Inst.), Toshiki Nokami (Tottori Univ), Yasumitsu Orii (NAGASE) SDM2022-91 |
The amount of the calculation cost of AI training increases exponentially, and this causes an increase in power consumpt... [more] | SDM2022-91 pp.27-32 |
| SDM | 2023-02-07 16:15 |
Tokyo | Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
Next-generation wearable electronics: Skin electronics Sunghoon Lee, Tomoyuki Yokota, Takao Someya (Univ. of Tokyo) SDM2022-92 |
(To be available after the conference date) [more] | SDM2022-92 pp.33-36 |
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