|
|
Technical Committee on Electromechanical Devices (EMD) (Searched in: 2008)
|
|
Search Results: Keywords 'from:2009-01-23 to:2009-01-23'
|
[Go to Official EMD Homepage] |
Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Ascending) |
|
Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EMD |
2009-01-23 13:35 |
Kanagawa |
|
[Invited Talk]
High Density Optical Interconnection Technologies for Large Capacity Infomation Processing Equipments Yasunobu Matsuoka, Takuma Ban, Reiko Mita, Toshiki Sugawara (Hitachi Ltd.,) EMD2008-113 |
As high density optical interconnection for the next generation large capacity information processing equipments, we hav... [more] |
EMD2008-113 pp.1-4 |
EMD |
2009-01-23 14:15 |
Kanagawa |
|
High Density Multi-Fiber Connector for Optical Interconnection Naoya Nishimura, Katsuki Suematsu, Masao Shinoda, Masato Shiino (The Furukawa Electric Co. Ltd.,) EMD2008-114 |
The performance limits of electrical interconnection in such equipment as servers and routers comes to be discussed, and... [more] |
EMD2008-114 pp.5-9 |
EMD |
2009-01-23 14:40 |
Kanagawa |
|
16-fiber Type SF connector for on-board optical wiring Ryo Nagase, Shuichiro Asakawa (NTT), Masaru Kobayashi (NTT-AT), Yoshiteru Abe (NTT) EMD2008-115 |
SF (Sagged Fiber) Connector uses elastic force (buckling force) of sagged fiber to achieve physical contact fiber-optic ... [more] |
EMD2008-115 pp.11-14 |
EMD |
2009-01-23 15:20 |
Kanagawa |
|
Degradation phenomenon of electrical contacts by hammering oscillating mechanism
-- for Contact Resistance (III) -- Shin-ichi Wada, Taketo Sonoda, Keiji Koshida, Mitsuo Kikuchi, Hiroaki Kubota (TMC System Co., Ltd.,), Koichiro Sawa (Keio Univ.) EMD2008-116 |
The authors have developed the hammering oscillating mechanism which could give real vibration to electrical contacts an... [more] |
EMD2008-116 pp.15-20 |
EMD |
2009-01-23 15:45 |
Kanagawa |
|
Synthesis of electroconductive diamond film for application as electrical contact Toshiki Tsubota, Tomoo Hamayama, Naoya Murakami, Teruhisa Ohno (Kyushu Inst. of Tech.), Tomoko Suenaga (Kumamoto Ind Res Inst.), Hiroyuki Nagahata (Sanyu Switch Co., Ltd.) EMD2008-117 |
We try to use electroconductive CVD diamond film as the material for electrical contact. Electroconductive
CVD diamond ... [more] |
EMD2008-117 pp.21-25 |
EMD |
2009-01-23 16:10 |
Kanagawa |
|
A Study of Solder Connection Reliability in Cooling Design for Outdoor Telecommunications Equipment Nobuhiro Tamayama, Shinya Hamagishi, Seiji Asai, Takeshi Tajiri, Osamu Kamimura (Hitachi Com Tech, Ltd.) EMD2008-118 |
In recent years, the sophistication of functions and the communication capacities of communications equipment have accel... [more] |
EMD2008-118 pp.27-32 |
EMD |
2009-01-23 16:35 |
Kanagawa |
|
Manufacturing Technology for Embedded LSI(WLP) Substrates Keisuke Okada (NEC Toppan Circuit Solutions. INC.) EMD2008-119 |
Device embedding technologies that make three-dimensional effective utilization of packaging space possible have attract... [more] |
EMD2008-119 pp.33-37 |
|
|
|
Copyright and reproduction :
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
|
[Return to Top Page]
[Return to IEICE Web Page]
|