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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
CAS, CS |
2023-03-01 16:40 |
Fukuoka |
Kitakyushu International Conference Center (Primary: On-site, Secondary: Online) |
Evaluation on TFI Pilot Signal and CNN Image Identification Based on Channel Model Tomoaki Shibata, Syuji Takahashi, Yuta Ida (Yamaguchi Univ.), Sho Kuroda (FX Systems), Takahiro Matsumoto (Kagoshima Univ.) CAS2022-109 CS2022-86 |
In International Telecommunication Union (ITU), the wireless channel models are standardized. The channel models are con... [more] |
CAS2022-109 CS2022-86 pp.77-82 |
CPM, OPE, LQE, R, EMD |
2015-08-27 14:15 |
Aomori |
Aomori-Bussankan-Asupamu |
[Invited Talk]
Heterogeneous Integration Technology Using Fluidic Self Assembly Based on Ga Molten Bumps Koichi Maezawa, Jun Nakano, Tomoaki Shibata, Hiroki Morita, Hiroshi Sakamoto, Satoshi Yamada, Masayuki Mori (Univ. Toyama) R2015-28 EMD2015-36 CPM2015-52 OPE2015-67 LQE2015-36 |
Fluidic Self Assembly (FSA) is a most promising heterogeneous integration technique leading to new applications of semic... [more] |
R2015-28 EMD2015-36 CPM2015-52 OPE2015-67 LQE2015-36 pp.27-32 |
ED |
2013-08-08 14:25 |
Toyama |
University of Toyama |
Fluidic Self-Assembly for Heterogeneous Integration of High Performance Resonant Tunneling Diodes using Molten Gallium Bumps Jun Nakano, Tomoaki Shibata, Hiroki Morita, Hiroshi Sakamoto, Masayuki Mori, Koichi Maezawa (Univ. of Toyama) ED2013-38 |
Fluidic Self-Assembly (FSA) using molten metal bumps is one of the most promising Heterogeneous Integration (HI) technol... [more] |
ED2013-38 pp.5-8 |
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