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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 5 of 5  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2010-10-22
13:40
Miyagi Tohoku University Integration of Novel Non-porous Low-k Dielectric Fluorocarbon into Advanced Cu Interconnects
Xun Gu, Takenao Nemoto, Yugo Tomita, Akinobu Teramoto, Shin-Ichiro Kuroki, Shigetoshi Sugawa, Tadahiro Ohmi (Tohoku Univ.) SDM2010-165
 [more] SDM2010-165
pp.53-56
SDM 2009-10-29
15:30
Miyagi Tohoku University Silicon Wafer Thinning Technology for Three-Dimensional Integrated Circuit by Wet Etching
Kazuhiro Yoshikawa, Tomotsugu Ohashi, Tatsuro Yoshida, Takenao Nemoto, Tadahiro Ohmi (Tohoku Univ.) SDM2009-120
A three-dimensional integrated circuit is developed as an emerging technology in a semiconductor industry. The silicon w... [more] SDM2009-120
pp.15-19
SDM 2009-10-29
16:15
Miyagi Tohoku University Tribological Study for Low Shear Force CMP Process on Damascene Interconnects
Xun Gu, Takenao Nemoto (Tohoku Univ.), Yasa Adi Sampurno (Univ. of Arizona/Araca,Inc.), Jiang Cheng, Sian Theng (Araca,Inc.), Akinobu Teramoto (Tohoku Univ.), Ricardo Duyos Mateo, Leonard Borucki (Araca,Inc.), Yun Zhuang, Ara Philipossian (Univ. of Arizona/Araca,Inc.), Shigetoshi Sugawa, Tadahiro Ohmi (Tohoku Univ.) SDM2009-121
 [more] SDM2009-121
pp.21-26
SDM 2008-10-09
13:30
Miyagi Tohoku Univ. Evaluation of Post Cu-CMP Cleaning Chemicals for Non-Porous Ultra Low-k Dielectric Fluorocarbon Film
Xun Gu, Takenao Nemoto, Akinobu Teramoto, Takashi Ito, Tadahiro Ohmi (Tohoku Univ.) SDM2008-149
 [more] SDM2008-149
pp.1-6
SDM 2008-10-09
14:00
Miyagi Tohoku Univ. Investigation of Novel End-Point-Detection for Ta/Cu CMP
Xun Gu, Takenao Nemoto (Tohoku Univ.), Ara Philipossian, Yasa Adi Sampurno (Univ. of Arizona/Araca), Jiang Cheng (Araca), Yun Zhuang (Univ. of Arizona/Araca), Akinobu Teramoto, Takashi Ito, Tadahiro Ohmi (Tohoku Univ.) SDM2008-150
 [more] SDM2008-150
pp.7-12
 Results 1 - 5 of 5  /   
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