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Committee Date Time Place Paper Title / Authors Abstract Paper #
LQE, OPE, CPM, EMD, R 2023-08-24
16:40		 Miyagi Tohoku university
(Primary: On-site, Secondary: Online)		 [Invited Talk] Failure Mode and Analytical Method for Chip Components -- Analysis Example and Correspondence to Miniaturization --
Akira Saito (Murata) R2023-25 EMD2023-20 CPM2023-30 OPE2023-69 LQE2023-16		 Higher reliability of electric components is demanded with the evolution of AI and the automatic driving. Electric chara... [more] R2023-25 EMD2023-20 CPM2023-30 OPE2023-69 LQE2023-16
pp.45-50
R 2017-11-16
15:30		 Osaka   Effects on Stresses in HALT
Raphael Pihet, Takuya Hirata, Hideki Kawai, Aoki Yuichi (ESPEC) R2017-53		 HALT (Highly Accelerated Limit Test) is an accelerated test which, by applying severe stresses, can identify the relativ... [more] R2017-53
pp.13-16
CPM, ICD 2008-01-18
14:15		 Tokyo Kikai-Shinko-Kaikan Bldg Assessment Test for Solder Joint Reliability in Mobile Products
Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155		 When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] CPM2007-144 ICD2007-155
pp.93-98
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