IEICE Technical Report

Print edition: ISSN 0913-5685      Online edition: ISSN 2432-6380

Volume 113, Number 48

Electromechanical Devices

Workshop Date : 2013-05-17 / Issue Date : 2013-05-10

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Table of contents

EMD2013-1
Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards
Tomokatsu Aizawa (Tokyo Metropolitan College)
pp. 1 - 4

EMD2013-2
Study on equilibrium mode distribution of HPCF
Tadahisa Iikubo, Ryo Nagase (Chiba Inst. of Tech.), Shigeru Kobayashi (Tyco Electronics Japan), Masatoshi Yonemura, Manabu Kagami (Toyota Central R&D Labs.)
pp. 5 - 9

EMD2013-3
Thermodynamic and Transport Properties of Arc occurring between Ag and Ag/SnO2 contact pairs in Ar atmosphere
Takuya Hara, Junya Sekikawa (Shizuoka Univ.)
pp. 11 - 16

EMD2013-4
Effect of regular supply of lubricant on slip-ring for small power transfer
Koichiro Sawa, Hideki Kitajima, Takahiro Ueno (Nippon Inst. of Tech.), Masaru Yamanoi, Hiroyasu Masubuchi (SERVO)
pp. 17 - 22

EMD2013-5
Various characteristics of Cu system contacts for electromagnetic contactors -- Arc duration and resistance of Cu and CuCr contacts --
Kiyoshi Yoshida, Koichiro Sawa (NIT), Kenji Suzuki, Hideki Daijima, Kouetsu Takaya (Fuji Electric FA Components & Systems)
pp. 23 - 28

EMD2013-6
Observation of damage shapes caused by break arcs on Ag and AgSnO2 contact surfaces during switching operations
Makoto Hasegawa, Keisuke Takahashi, Daichi Kawamura, Yuya Hirano (Chitose Inst. of Science and Tech.)
pp. 29 - 34

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan