IEICE Technical Report

Online edition: ISSN 2432-6380

Silicon Device and Materials

Workshop Date : 2025-02-19 / Issue Date : 2025-02-12

SDM2024-71
[Invited Talk] Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
Koichi Motoyama (IBM)
p. 1

SDM2024-72
[Invited Talk] Fluorine-free Word Line Molybdenum Process for Enhancing Scalability and Reliability in 3D Flash Memory
Takashi Fukushima (KIOXIA)
p. 2

SDM2024-73
[Invited Talk] The Growing Importance of Wet Processing in 3D Semiconductor Fabrication
Tomohisa Sato (SCREEN)
pp. 3 - 6

SDM2024-74
[Invited Talk] Surface Topography Control for Polymer/Cu Hybrid Bonding
Yuzo Nakamura (YNU/MCI), Yutetsu Kamiya, Yusuke Kondo, Kenta Hayama, Fabiana Lie Tanaka, Fumihiro Inoue (YNU)
pp. 7 - 10

SDM2024-75
[Invited Talk] Study for realization of the next generation high density RDL packaging for 2.5D large silicon interposer.
Masaki Mizutani, Ken-ichiro Shinoda, Ken-ichiro Mori (canon)
pp. 11 - 14

SDM2024-76
[Invited Talk] D2W Hybrid Bonding System Achieving High Accuracy and High Throughput With Minimal Configurations
Mihara Kentaro, Hare Takashi, Miyoshi Takayuki, Hirofumi Sakai, Aoki Shimpei, Toyoharu Terada (TRENG), Hiroyuki Hashimoto, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima (TU), Fumihiro Inoue (YNU), Akira Uedono (UT)
pp. 15 - 18

SDM2024-77
[Invited Talk] Photosensitive Polyimide with High Planarity and Ultra-Low-Temperature Curability for Heterogeneous Integration
Takehiko Kanbara, Atsutaro Yoshizawa, Akira Asada, Daisaku Matsukawa (HDM)
pp. 19 - 22

SDM2024-78
[Invited Talk] Study on High Thermal Conductivity AlN Films for 3D Chiplets with Excellent Heat Dissipation
Takeshi Takagi, Takeki Ninomiya, Masaaki Niwa, Soken Obara, Takeshi Momose, Yukihiro Shimogaki, Masahiro Nomura, Hiroshi Fujioka (UTokyo), Masakazu Mori (Ryukoku U.), Tadahiro Kuroda (UTokyo)
pp. 23 - 26

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan