IEICE Technical Report

Online edition: ISSN 2432-6380

Component Parts and Materials

Workshop Date : 2026-08-27 - 2026-08-28 / Issue Date : 2026-08-20

CPM2026-21
Influence of Geometrical Variations of Electrical Contacts with an Airflow-Blowing Structure on Break Arc Duration
Yosei Terazawa, Junya Sekikawa (Shizuoka Univ.)
pp. 1 - 6

CPM2026-22
Analysis of Surface Morphology Before and After Contact in Electrical Contact Pairs with Different Surface Roughness
Yudai Suzuki, Junya Sekikawa (Shizuoka Univ.)
pp. 7 - 12

CPM2026-23
A Study on Optimal Design of Defected Ground Structure for Differential Paired-Lines using Topology Optimization -- Part 2 --
Yoshiki kayano (UEC)
pp. 13 - 18

CPM2026-24
A Study on a TDDB Lifetime Prediction Model for Gate Insulated Thin Films
Yasushi Kadota, Shinji Yokokawa (UEC)
pp. 19 - 24

CPM2026-25
Quantification of Land-Referenced Solder Formation Deviation and Generation of Physical-Quantity Labels in Hand-Soldered Printed Circuit Board Images
Yuta Kawakatsu, Tsuyoshi Tanaka, Masaki Endo, Kenji Terada (PTU)
pp. 25 - 30

CPM2026-26
[Invited Talk] Optical Interconnects and Standardization Trends in the AI Data Center Era
Hideki Isono (IGS)
pp. 31 - 36

CPM2026-27
Design and Fabrication of Si waveguide DBR resonator for wavelength selectable devices using FLC
Hisashi Tatsuno, Hayama Yoshiki, Nakatsuhara Katsumi (KAIT)
pp. 37 - 42

CPM2026-28
Design and experimental demonstration of ultrasmall mode mixers based on mosaic structure designed by using gradient direct binary search method
Shizunari Aomori (Hosei Univ.), Yasuhide Tsuji (Muroran IT), Takuya Mitarai, Yusuke Sawada, Takuya Okimoto, Takuo Hiratani, Kento Komatsu, Hideki Yagi, Naoki Fujiwara (Sumitomo Electric), Takeshi Fujisawa (Hosei Univ.)
pp. 43 - 48

CPM2026-29
Effects of annealing on electrical properties of boron carbide films prepared by magnetron sputtering
Yusuke Hayashi, Iori Akimoto, Yushi Suzuki, Yasuyuki Kobayashi, Hideki Nakazawa (Hirosaki Univ.)
pp. 49 - 52

CPM2026-30
[Invited Talk] CFB Solutions for Accelerating Heterogeneous Integration -- Mass Production Technology and Open Innovation Supporting the Evolution of Photo-Electronic Convergence1 --
Kenichi Tanigawa, Hironori Furuta, Hiroyuki Takahashi, Takahito Suzuki (OKI), Nobuhiko Nishiyama (Science Tokyo)
pp. 53 - 56

CPM2026-31
[Invited Talk] Heterogeneous Photonic Chiplet Integrated by Micro-Transfer Printing
Rai Kou, Toshiya Murai, Noritsugu Yamamoto (AIST)
pp. 57 - 59

CPM2026-32
[Invited Talk] Prospects for III-V membrane optical modulators toward co-packaged optics
Mitsuru Takenaka (Univ. Tokyo)
pp. 60 - 62

CPM2026-33
[Invited Talk] Heterogeneous Material Bonding Platform Toward III-V Semiconductor and Silicon Photonics Integration
Naoko Inoue, Hideki Yagi, Naoki Fujiwara, Masaki Yanagisawa (SEI)
pp. 63 - 66

CPM2026-34
Interface Reduction in Optical Accelerators by Two-Dimensional Activation Functions
Yamato Misugi, Chua Hanns Christian J., Junichi Suzuki, Junya Nishioka, Mizuki Shirao, Nobuo Ohata (Mitsubishi Electric)
pp. 67 - 70

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan