| Paper Abstract and Keywords |
| Presentation |
2007-01-19 15:45
Wid eband Decoupling Properties by the Combination of Ultra-thin Insulator and EBG Structure
Seiju Ichijo (Toshiba), Takanobu Kushihira (MSC), Toshio Sudo (Toshiba) |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
Wide-band decoupling property of power/ground structure of a printed circuit board is required for the high-speed digital applications. Low S21 property with around -60 dB can be obtained by simply using thin dielectric layer of 16 um. While, the EBG (electromagnetic bandgap) structure with relatively thick dielectric layer of 500 um showed the typical stop-band property. By combining ultra-thin dielectric layer and EBG structure, low S21 property with wideband upto several GHz range has been obtained along with high isolation property of more than -80dB. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
PCB / S parameter / SSN / EMI / EBG structure / ultra-thin insulator / / |
| Reference Info. |
IEICE Tech. Rep., vol. 106, no. 467, CPM2006-153, pp. 137-142, Jan. 2007. |
| Paper # |
CPM2006-153 |
| Date of Issue |
2007-01-11 (CPM, ICD) |
| ISSN |
Print edition: ISSN 0913-5685 |
| Download PDF |
|
| Conference Information |
| Committee |
ICD CPM |
| Conference Date |
2007-01-18 - 2007-01-19 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
Kika-Shinko-Kaikan Bldg. |
| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
LSI system assembly and module/inteface technology, test, general |
| Paper Information |
| Registration To |
CPM |
| Conference Code |
2007-01-ICD-CPM |
| Language |
Japanese |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
Wid eband Decoupling Properties by the Combination of Ultra-thin Insulator and EBG Structure |
| Sub Title (in English) |
|
| Keyword(1) |
PCB |
| Keyword(2) |
S parameter |
| Keyword(3) |
SSN |
| Keyword(4) |
EMI |
| Keyword(5) |
EBG structure |
| Keyword(6) |
ultra-thin insulator |
| Keyword(7) |
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| Keyword(8) |
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| 1st Author's Name |
Seiju Ichijo |
| 1st Author's Affiliation |
Toshiba Corp. (Toshiba) |
| 2nd Author's Name |
Takanobu Kushihira |
| 2nd Author's Affiliation |
Manufacturing Engineering Corp. (MSC) |
| 3rd Author's Name |
Toshio Sudo |
| 3rd Author's Affiliation |
Toshiba Corp. (Toshiba) |
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| Speaker |
Author-3 |
| Date Time |
2007-01-19 15:45:00 |
| Presentation Time |
25 minutes |
| Registration for |
CPM |
| Paper # |
CPM2006-153, ICD2006-195 |
| Volume (vol) |
vol.106 |
| Number (no) |
no.467(CPM), no.468(ICD) |
| Page |
pp.137-142 |
| #Pages |
6 |
| Date of Issue |
2007-01-11 (CPM, ICD) |