| Paper Abstract and Keywords |
| Presentation |
2007-01-19 09:25
Ultra-Fine Pitch Cu Bumpless Interconnect for High Density System Integration
Aktisu Shigetou, Toshihiro Itoh, Tadatomo Suga (Univ. of Tokyo) |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
We report the studies on the ultra-fine pitch Cu bumpless interconnect relating to the direct bonding of CMP-Cu done by the surface activated bonding (SAB) method. Since the quality of bonding in the SAB method is strongly affected by contact and cleanness of a surface, we clarified the relationship between those conditions and Ar beam irradiation. We also developed a highly accurate SAB process for the bumpless test vehicles fabricated by the applied damascene process, then realized a 10-um-pitch interconnection together with considerably low contact resistance. Furthermore, a wafer-scale high-density bonding and the bonding between thin devices were carried out as a preliminary feasibility study. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
Bumpless Interconnect / surface activated bonding (SAB) / CMP-Cu / / / / / |
| Reference Info. |
IEICE Tech. Rep., vol. 106, no. 467, CPM2006-142, pp. 77-81, Jan. 2007. |
| Paper # |
CPM2006-142 |
| Date of Issue |
2007-01-11 (CPM, ICD) |
| ISSN |
Print edition: ISSN 0913-5685 |
| Download PDF |
|
| Conference Information |
| Committee |
ICD CPM |
| Conference Date |
2007-01-18 - 2007-01-19 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
Kika-Shinko-Kaikan Bldg. |
| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
LSI system assembly and module/inteface technology, test, general |
| Paper Information |
| Registration To |
CPM |
| Conference Code |
2007-01-ICD-CPM |
| Language |
Japanese |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
Ultra-Fine Pitch Cu Bumpless Interconnect for High Density System Integration |
| Sub Title (in English) |
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| Keyword(1) |
Bumpless Interconnect |
| Keyword(2) |
surface activated bonding (SAB) |
| Keyword(3) |
CMP-Cu |
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| 1st Author's Name |
Aktisu Shigetou |
| 1st Author's Affiliation |
the University of Tokyo (Univ. of Tokyo) |
| 2nd Author's Name |
Toshihiro Itoh |
| 2nd Author's Affiliation |
the University of Tokyo (Univ. of Tokyo) |
| 3rd Author's Name |
Tadatomo Suga |
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the University of Tokyo (Univ. of Tokyo) |
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| Speaker |
Author-1 |
| Date Time |
2007-01-19 09:25:00 |
| Presentation Time |
25 minutes |
| Registration for |
CPM |
| Paper # |
CPM2006-142, ICD2006-184 |
| Volume (vol) |
vol.106 |
| Number (no) |
no.467(CPM), no.468(ICD) |
| Page |
pp.77-81 |
| #Pages |
5 |
| Date of Issue |
2007-01-11 (CPM, ICD) |