Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2011-02-07 16:25
Highly Manufacturable ELK Integration Technology with Metal Hard Mask Process for High Performance 32nm-node Interconnect and Beyond
S. Matsumoto, T. Harada, Y. Morinaga, D. Inagaki, J. Shibata, K. Tashiro, T. Kabe, Akihisa Iwasaki, S. Hirao, M. Tsutsue, K. Nomura, K. Seo, T. Hinomura, Naoki Torazawa, S. Suzuki (Panasonic) SDM2010-226
Abstract (in Japanese) (See Japanese page) 
(in English) High performance 32nm-node interconnect with ELK (Extremely Low-k, k=2.4) has been demonstrated. The two main key technologies are as follows;
1) To suppress process damage and enlarge the via-line space with a wide lithography process margin, robust ELK film with a metal hard mask (MHM) self-aligned via process has been developed. It has accomplished both ultimate low capacitance wirings that demonstrated maximum ELK performance and high TDDB reliability between Cu lines with vias.
2) A novel technique of interface engineering between ELK and a liner layer has been developed to strengthen the tolerance against chip packaging. This has achieved highly reliable chip packaging.
This complete process has a high manufacturability and it therefore offers a promising technology for the 32-nm node and beyond.
Keyword (in Japanese) (See Japanese page) 
(in English) Cu interconnect / Porous low-k / Metal hard mask / TDDB reliability / Package / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 408, SDM2010-226, pp. 59-63, Feb. 2011.
Paper # SDM2010-226 
Date of Issue 2011-01-31 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2010-226

Conference Information
Committee SDM  
Conference Date 2011-02-07 - 2011-02-07 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2011-02-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Highly Manufacturable ELK Integration Technology with Metal Hard Mask Process for High Performance 32nm-node Interconnect and Beyond 
Sub Title (in English)  
Keyword(1) Cu interconnect  
Keyword(2) Porous low-k  
Keyword(3) Metal hard mask  
Keyword(4) TDDB reliability  
Keyword(5) Package  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name S. Matsumoto  
1st Author's Affiliation Panasonic (Panasonic)
2nd Author's Name T. Harada  
2nd Author's Affiliation Panasonic (Panasonic)
3rd Author's Name Y. Morinaga  
3rd Author's Affiliation Panasonic (Panasonic)
4th Author's Name D. Inagaki  
4th Author's Affiliation Panasonic (Panasonic)
5th Author's Name J. Shibata  
5th Author's Affiliation Panasonic (Panasonic)
6th Author's Name K. Tashiro  
6th Author's Affiliation Panasonic (Panasonic)
7th Author's Name T. Kabe  
7th Author's Affiliation Panasonic (Panasonic)
8th Author's Name Akihisa Iwasaki  
8th Author's Affiliation Panasonic (Panasonic)
9th Author's Name S. Hirao  
9th Author's Affiliation Panasonic (Panasonic)
10th Author's Name M. Tsutsue  
10th Author's Affiliation Panasonic (Panasonic)
11th Author's Name K. Nomura  
11th Author's Affiliation Panasonic (Panasonic)
12th Author's Name K. Seo  
12th Author's Affiliation Panasonic (Panasonic)
13th Author's Name T. Hinomura  
13th Author's Affiliation Panasonic (Panasonic)
14th Author's Name Naoki Torazawa  
14th Author's Affiliation Panasonic (Panasonic)
15th Author's Name S. Suzuki  
15th Author's Affiliation Panasonic (Panasonic)
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2011-02-07 16:25:00 
Presentation Time 30 minutes 
Registration for SDM 
Paper # SDM2010-226 
Volume (vol) vol.110 
Number (no) no.408 
Page pp.59-63 
#Pages 5 
Date of Issue 2011-01-31 (SDM) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan