Paper Abstract and Keywords |
Presentation |
2013-11-14 14:50
Effect of Plate-Shape Ni-Sn IMC on the Growth Mechanism of Tin Whisker under Thermal Shock Stress Akira Saito, Akira Okamoto, Yoshihiro Iwahori, Makoto Ogawa (Mutrata MFG), Akihiro Motoki (Sabae Mutrata MFG) R2013-76 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
With the promotion of lead-free solder in these years, some segments have expressed concern about the possibility of tin whisker formation in high-reliability applications. In our recent report, it was revealed that the formation of plate-shape Ni-Sn intermetallic compound (IMC) in tin plating layer inhibits the tin whisker growth under thermal shock stress. In this report, we propose that the thermal stress reduction by the nodule growth that promoted by plate-shape Ni-Sn IMC in tin layer causes the inhibition of whisker growth. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Tin Whisker / Thermal Stress / Intermetallic Compound / Nodule / SEM observation / NiSn4 / / |
Reference Info. |
IEICE Tech. Rep., vol. 113, no. 289, R2013-76, pp. 11-16, Nov. 2013. |
Paper # |
R2013-76 |
Date of Issue |
2013-11-07 (R) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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R2013-76 |
Conference Information |
Committee |
R |
Conference Date |
2013-11-14 - 2013-11-14 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
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Topics (in Japanese) |
(See Japanese page) |
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Paper Information |
Registration To |
R |
Conference Code |
2013-11-R |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Effect of Plate-Shape Ni-Sn IMC on the Growth Mechanism of Tin Whisker under Thermal Shock Stress |
Sub Title (in English) |
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Keyword(1) |
Tin Whisker |
Keyword(2) |
Thermal Stress |
Keyword(3) |
Intermetallic Compound |
Keyword(4) |
Nodule |
Keyword(5) |
SEM observation |
Keyword(6) |
NiSn4 |
Keyword(7) |
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Keyword(8) |
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1st Author's Name |
Akira Saito |
1st Author's Affiliation |
Murata Manufacturing Co., Ltd. (Mutrata MFG) |
2nd Author's Name |
Akira Okamoto |
2nd Author's Affiliation |
Murata Manufacturing Co., Ltd. (Mutrata MFG) |
3rd Author's Name |
Yoshihiro Iwahori |
3rd Author's Affiliation |
Murata Manufacturing Co., Ltd. (Mutrata MFG) |
4th Author's Name |
Makoto Ogawa |
4th Author's Affiliation |
Murata Manufacturing Co., Ltd. (Mutrata MFG) |
5th Author's Name |
Akihiro Motoki |
5th Author's Affiliation |
Sabae Murata Manufacturing Co., Ltd. (Sabae Mutrata MFG) |
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Speaker |
Author-1 |
Date Time |
2013-11-14 14:50:00 |
Presentation Time |
25 minutes |
Registration for |
R |
Paper # |
R2013-76 |
Volume (vol) |
vol.113 |
Number (no) |
no.289 |
Page |
pp.11-16 |
#Pages |
6 |
Date of Issue |
2013-11-07 (R) |
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