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Paper Abstract and Keywords
Presentation 2014-02-28 13:50
[Invited Talk] Novel Implantation Process of Carbon Nanotubes for Plugs and Vias, and their Integration with Transferred Multilayer Graphene Wire Obtained by Annealing Sputtered Amorphous Carbon
Motonobu Sato, Makoto Takahashi, Mizuhisa Nihei, Shintaro Sato, Naoki Yokoyama (AIST) SDM2013-170
Abstract (in Japanese) (See Japanese page) 
(in English) We have developed a novel process, the implantation of carbon nanotubes (CNTs) into holes like plugs, vias, and through-silicon vias (TSVs) for the first time. The developed room-temperature process is suitable for back-end-of-line (BEOL) processes of LSI. With this approach, we can use high-quality CNTs grown at high temperature on a different substrate and densify the CNTs. Consequently, the implanted CNT plugs with metal wires had a resistance one order of magnitude lower than the directly grown CNT plugs. In addition, by using TiN/Ti as contact metal layers, we successfully integrated the implanted CNT plug with transferred multilayer graphene (MLG) wires obtained by annealing sputtered amorphous carbon for all carbon interconnects. The implantation method is expected to be able to fabricate the low-resistance CNT plugs by using high-quality CNTs and improving the connection to the wires.
Keyword (in Japanese) (See Japanese page) 
(in English) Carbon nanotube / Implantation / Plug / Multilayer graphene / Transfer / Interconnects / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 451, SDM2013-170, pp. 29-33, Feb. 2014.
Paper # SDM2013-170 
Date of Issue 2014-02-21 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee SDM  
Conference Date 2014-02-28 - 2014-02-28 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2014-02-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Novel Implantation Process of Carbon Nanotubes for Plugs and Vias, and their Integration with Transferred Multilayer Graphene Wire Obtained by Annealing Sputtered Amorphous Carbon 
Sub Title (in English)  
Keyword(1) Carbon nanotube  
Keyword(2) Implantation  
Keyword(3) Plug  
Keyword(4) Multilayer graphene  
Keyword(5) Transfer  
Keyword(6) Interconnects  
Keyword(7)  
Keyword(8)  
1st Author's Name Motonobu Sato  
1st Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
2nd Author's Name Makoto Takahashi  
2nd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
3rd Author's Name Mizuhisa Nihei  
3rd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
4th Author's Name Shintaro Sato  
4th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
5th Author's Name Naoki Yokoyama  
5th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
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Speaker Author-1 
Date Time 2014-02-28 13:50:00 
Presentation Time 30 minutes 
Registration for SDM 
Paper # SDM2013-170 
Volume (vol) vol.113 
Number (no) no.451 
Page pp.29-33 
#Pages 5 
Date of Issue 2014-02-21 (SDM) 

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