| IEICE Technical Committee Submission System Conference Paper's Information |
Online Proceedings [Sign in] Tech. Rep. Archives |
| Go Top Page | Go Previous | [Japanese] / [English] |
| Paper Abstract and Keywords | ||
| Presentation | 2021-10-27 10:30 Study on the low-temperature deposition method of SiNx film for Cu-TSV Masaru Sato, Mayumi B. Takeyama (Kitami Inst. of Tech.)  CPM2021-21 Link to ES Tech. Rep. Archives: CPM2021-21 |
|
| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | For Cu through silicon via in the 3D-LSI, It is desired to realize a deposition method of an insulating film less than 200℃. In this study, deposition method combining reactive sputtering and radical treatment and characteristics of SiNx films of this method were examined. As a result, it was clarified that an excellent SiNx film can be obtained by the deposition method combining the reactive sputtering method and the radical treatment as compared with the usual reactive sputtering method. Therefore, a deposition method that combines a reactive sputtering method and a radical treatment may be one of the deposition methods of SiNx film for low-temperature preparation. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | 3D-LSI / through silicon via / reactive sputtering / radical treatment / low temperature deposition / SiNx film / / | |
| Reference Info. | IEICE Tech. Rep., vol. 121, no. 220, CPM2021-21, pp. 5-7, Oct. 2021. | |
| Paper # | CPM2021-21 | |
| Date of Issue | 2021-10-20 (CPM) | |
| ISSN | Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | CPM2021-21 Link to ES Tech. Rep. Archives: CPM2021-21 |
|
| Conference Information | |
| Committee | CPM |
| Conference Date | 2021-10-27 - 2021-10-27 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Functional materials (semiconductors, magnetic materials, dielectrics, transparent conductors / semiconductors, etc.) thin film processes / materials / devices, etc. |
| Paper Information | |
| Registration To | CPM |
| Conference Code | 2021-10-CPM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Study on the low-temperature deposition method of SiNx film for Cu-TSV |
| Sub Title (in English) | |
| Keyword(1) | 3D-LSI |
| Keyword(2) | through silicon via |
| Keyword(3) | reactive sputtering |
| Keyword(4) | radical treatment |
| Keyword(5) | low temperature deposition |
| Keyword(6) | SiNx film |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Masaru Sato |
| 1st Author's Affiliation | Kitami Institute of Technology (Kitami Inst. of Tech.) |
| 2nd Author's Name | Mayumi B. Takeyama |
| 2nd Author's Affiliation | Kitami Institute of Technology (Kitami Inst. of Tech.) |
| 3rd Author's Name | |
| 3rd Author's Affiliation | () |
| 4th Author's Name | |
| 4th Author's Affiliation | () |
| 5th Author's Name | |
| 5th Author's Affiliation | () |
| 6th Author's Name | |
| 6th Author's Affiliation | () |
| 7th Author's Name | |
| 7th Author's Affiliation | () |
| 8th Author's Name | |
| 8th Author's Affiliation | () |
| 9th Author's Name | |
| 9th Author's Affiliation | () |
| 10th Author's Name | |
| 10th Author's Affiliation | () |
| 11th Author's Name | |
| 11th Author's Affiliation | () |
| 12th Author's Name | |
| 12th Author's Affiliation | () |
| 13th Author's Name | |
| 13th Author's Affiliation | () |
| 14th Author's Name | |
| 14th Author's Affiliation | () |
| 15th Author's Name | |
| 15th Author's Affiliation | () |
| 16th Author's Name | |
| 16th Author's Affiliation | () |
| 17th Author's Name | |
| 17th Author's Affiliation | () |
| 18th Author's Name | |
| 18th Author's Affiliation | () |
| Speaker | Author-1 |
| Date Time | 2021-10-27 10:30:00 |
| Presentation Time | 20 minutes |
| Registration for | CPM |
| Paper # | CPM2021-21 |
| Volume (vol) | vol.121 |
| Number (no) | no.220 |
| Page | pp.5-7 |
| #Pages | 3 |
| Date of Issue | 2021-10-20 (CPM) |
[Return to Top Page]