IEICE Technical Committee Submission System
Conference Schedule		 Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

Technical Committee on Reliability (R)  (Searched in: 2013)

Search Results: Keywords 'from:2013-11-14 to:2013-11-14'
[Go to Official R Homepage (Japanese)] 
Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Ascending)
 Results 1 - 6 of 6  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
R 2013-11-14
14:00		 Osaka   Newest non-destructive X-ray inspection technology of conducting research and development and failure analysis -- It introduces from the foundation to application. --
Masahito Natsuhara (shimadzu) R2013-74		 Newest non-destructive X-ray inspection technology of conducting research
and development and failure analysis
－It int... [more]		 R2013-74
pp.1-3
R 2013-11-14
14:25		 Osaka   Effective non-destructive defect localization by using Enhanced Lock-In Thermography
Toshinobu Nagatomo (DCG Systems) R2013-75		 ELITE has been widely accepted as an effective non- destructive defect localization tool. It is based on Lock-in Thermog... [more] R2013-75
pp.5-9
R 2013-11-14
14:50		 Osaka   Effect of Plate-Shape Ni-Sn IMC on the Growth Mechanism of Tin Whisker under Thermal Shock Stress
Akira Saito, Akira Okamoto, Yoshihiro Iwahori, Makoto Ogawa (Mutrata MFG), Akihiro Motoki (Sabae Mutrata MFG) R2013-76		 With the promotion of lead-free solder in these years, some segments have expressed concern about the possibility of tin... [more] R2013-76
pp.11-16
R 2013-11-14
15:15		 Osaka   A Study on Sn-whisker growth by thermal cycle
Sadanori Itou (Itoken office) R2013-77		 Sn whisker grow up like curl shape under the thermal cycle test. However in some conditions, it grow up straight shape. ... [more] R2013-77
pp.17-20
R 2013-11-14
15:40		 Osaka   Bayesian Reliability Analysis for Software Debugging Processes Based on Remaining Errors
Toru Kaise (Univ. of Hyogo) R2013-78		  [more] R2013-78
pp.21-24
R 2013-11-14
16:05		 Osaka   Issues and Perspectives of Dependable LSI Design
Koichiro Takayama, Akira Asato (Fujitsu) 		 [more]
 Results 1 - 6 of 6  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan