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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
ED |
2009-07-31 11:15 |
Osaka |
Osaka Univ. Icho-Kaikan |
Study of Electroless Copper Plating for Through Si Via Filling Fumihiro Inoue, Takumi Yokoyama (Kansai Univ.), Kazuhiro Yamamoto, Shukichi Tanaka (NiCT), Shoso Shingubara (Kansai Univ.) ED2009-111 |
In recent studies, The formation of through-Silicon via hole (TSV) which stacks multiple layers of thin Si substrates is... [more] |
ED2009-111 pp.47-50 |
SDM |
2008-03-14 15:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Through-silicon Via Interconnection for 3D Integration Using Room-temperature Bonding Naotaka Tanaka, Yasuhiro Yoshimura, Michihiro Kawashita (Hitachi), Toshihide Uematsu, Takahiro Naitoh, Takashi Akazawa (Renesas) SDM2007-277 |
One approach to 3D technology is chip stacking using through-silicon vias (TSVs). Interconnects in a 3D assembly are pot... [more] |
SDM2007-277 pp.21-26 |
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