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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2016-01-22
15:25		 Tokyo Sanjo Conference Hall, The University of Tokyo [Invited Talk] Novel reconfigured wafer-to-wafer(W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration
Kangwook Lee, Taksfumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) SDM2015-117		  [more] SDM2015-117
pp.39-43
SDM 2014-02-28
15:20		 Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] TSV Liner Formation with Vapor Deposited Polyimides
Takafumi Fukushima, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Mitsumasa Koyanagi (Tohoku Univ.) SDM2013-172		 A Kapton insulation layer as a TSV liner was conformably formed by vapor deposition polymerization with pyromellitic dia... [more] SDM2013-172
pp.39-42
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM
(Joint) [detail]		 2012-11-27
10:45		 Fukuoka Centennial Hall Kyushu University School of Medicine [Invited Talk] Overview of 3D Integration Technology and Challenges for Volume Production
Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) CPM2012-115 ICD2012-79		  [more] CPM2012-115 ICD2012-79
pp.15-22
SDM 2010-02-05
10:05		 Tokyo Kikai-Shinko-Kaikan Bldg. [Keynote Address] Key Issues and Future Prospects for 3-D Integration Technology
Mitsumasa Koyanagi, Takafumi Fukushima, Kangwook Lee, Tetsu Tanaka (Tohoku Univ.) SDM2009-182		  [more] SDM2009-182
pp.1-6
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