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Committee Date Time Place Paper Title / Authors Abstract Paper #
ED, MW 2014-01-17
14:20		 Tokyo Kikai-Shinko-Kaikan Bldg. E-Band Transmitter and Receiver Modules With Simply Reflow-Soldered 3-D WLCSP MMIC's
Koji Tsukashima, Miki Kubota, Osamu Baba, Takeshi Kawasaki, Atsushi Yonamine, Tsuneo Tokumitsu (SEI), Yuichi Hasegawa (SEDI) ED2013-131 MW2013-196		  [more] ED2013-131 MW2013-196
pp.121-124
ED, MW 2010-01-15
11:45		 Tokyo Kikai-Shinko-Kaikan Bldg Cost Effective Wafer-Level Chip Size Package Technology and Application for High Speed Wireless Communications.
Seiji Fujita, Masaki Imagawa, Tomio Satoh (SEDI), Tsuneo Tokumitsu (SEI), Yuichi Hasegawa (SEDI) ED2009-195 MW2009-178		 Cost effective Ku-band up-mixer and down-mixer MMIC’s, that use a three-dimensional MMIC technology optimized for flip-c... [more] ED2009-195 MW2009-178
pp.117-121
MW 2006-09-06
16:00		 Tokyo   [Invited Talk] -
Tsuneo Tokumitsu (EUD) 		This invited talk describes my history, first, which brought myself in to a position to be nominated for IEEE Fellow. Al... [more] MW2006-102
pp.151-159
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