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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
MWP, OPE, MW, EMT, EST, IEE-EMT [detail] |
2012-07-27 11:20 |
Hokkaido |
Hokkaido Univ. |
Estimation of Propagation Characteristics of Wireless LAN on Aircraft Using Large Scale FDTD Analysis Masaki Kinoshita, Takashi Hikage, Toshio Nojima (Hokkaido Univ.), Shunichi Futatsumori, Akiko Kohmura, Naruto Yonemoto (ENRI) MW2012-50 OPE2012-43 EST2012-32 MWP2012-31 |
[more] |
MW2012-50 OPE2012-43 EST2012-32 MWP2012-31 pp.149-152 |
EMCJ |
2011-09-12 15:50 |
Hokkaido |
Hokkaido Univ. |
Estimations of Implantable Cardiac Pacemaker EMI due to Magnetic Resonant Coil for Wireless Power Transfer Using FDTD Analysis Masaki Kinoshita, Takashi Hikage, Toshio Nojima (Hokkaido Univ.) EMCJ2011-77 |
[more] |
EMCJ2011-77 pp.33-36 |
VLD |
2010-03-11 16:05 |
Okinawa |
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Evaluation of a Detail Via Arrangement Method for 2-Layer Ball Grid Array Packages Masaki Kinoshita (Tokyo Inst. of Tech.), Yoichi Tomioka (Tokyo Univ. of Agr and Tech.), Atsushi Takahashi (Osaka Univ.) VLD2009-117 |
It takes a lot of time to obtain a routing design of the ball grid array (BGA) package which is one of LSI package, sinc... [more] |
VLD2009-117 pp.109-114 |
VLD |
2009-09-24 13:55 |
Osaka |
Osaka University |
A Detail Via Arrangement Method for Reduction of Wire Congestion in 2-Layer Ball Grid Array Packages Masaki Kinoshita, Yoichi Tomioka (Tokyo Inst. of Tech.), Atsushi Takahashi (Osaka Univ.) VLD2009-30 |
A BGA package realizes a lot of connections between a chip and a printed board.
The quality of routing design obtained ... [more] |
VLD2009-30 pp.7-12 |
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