IEICE Technical Report

Print edition: ISSN 0913-5685      Online edition: ISSN 2432-6380

Volume 107, Number 213

Reliability

Workshop Date : 2007-09-14 / Issue Date : 2007-09-07

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Table of contents

R2007-29
Material Processing by Microplasma in SEM
Hidenori Ohi, Yasuaki Okazaki, Tomoyoshi Takahashi, Akimitsu Hatta (Kochi Univ. Technol.)
pp. 1 - 4

R2007-30
Fault logic trace by Using Transistor Operating Point Analysis -- Diagnosis of Feed Back Fault with Oscillating Phenomenon --
Masaru Sanada, Tonoya Nakamura, Keishi Hashida (KUT)
pp. 5 - 10

R2007-31
An idea of fault model by RC network, and the transistor level fault diagnosis trial.
Yutaka Yoshizawa (NEC Electoronics)
pp. 11 - 16

R2007-32
[Invited Talk] The Latest Trend of Defect Modeling in LSI Diagnosis -- Tutorial --
Yasuo Sato (Hitachi)
pp. 17 - 22

R2007-33
An expanded Per-Test X-Fault Diagnosis Method for LSI Circuits
Yusuke Nakamura, Yuta Yamato, Xiaoqing Wen, Kohei Miyase, Seiji Kajihara (KIT), K. K. Saluja (Univ. of Wisconsin)
pp. 23 - 28

R2007-34
Evaluation of transmission line for LSI tester and simulation modeling
Hidekazu Tsuchiya, Takeshi Asakawa (Tokai univ.), Masayuki Sato (Genesis technology)
pp. 29 - 34

R2007-35
The failure analyses and the article of good quality analysis of the electronic component -- The efforts for the reliability improvement of the electronic component which is for automobile use --
Yasuo Imai, Daiki Tanaka (OEG)
pp. 35 - 39

R2007-36
Structural analysis as quality evaluation of LSI manufacturing.
Masahito Kajinuma, Akira Mizoguchi, Koichirou Takeuchi (MELCO)
pp. 41 - 44

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan