IEICE Technical Report

Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380

Electromechanical Devices

Workshop Date : 2009-01-23 / Issue Date : 2009-01-16

EMD2008-113
[Invited Talk] High Density Optical Interconnection Technologies for Large Capacity Infomation Processing Equipments
Yasunobu Matsuoka, Takuma Ban, Reiko Mita, Toshiki Sugawara (Hitachi Ltd.,)
pp. 1 - 4

EMD2008-114
High Density Multi-Fiber Connector for Optical Interconnection
Naoya Nishimura, Katsuki Suematsu, Masao Shinoda, Masato Shiino (The Furukawa Electric Co. Ltd.,)
pp. 5 - 9

EMD2008-115
16-fiber Type SF connector for on-board optical wiring
Ryo Nagase, Shuichiro Asakawa (NTT), Masaru Kobayashi (NTT-AT), Yoshiteru Abe (NTT)
pp. 11 - 14

EMD2008-116
Degradation phenomenon of electrical contacts by hammering oscillating mechanism -- for Contact Resistance (III) --
Shin-ichi Wada, Taketo Sonoda, Keiji Koshida, Mitsuo Kikuchi, Hiroaki Kubota (TMC System Co., Ltd.,), Koichiro Sawa (Keio Univ.)
pp. 15 - 20

EMD2008-117
Synthesis of electroconductive diamond film for application as electrical contact
Toshiki Tsubota, Tomoo Hamayama, Naoya Murakami, Teruhisa Ohno (Kyushu Inst. of Tech.), Tomoko Suenaga (Kumamoto Ind Res Inst.), Hiroyuki Nagahata (Sanyu Switch Co., Ltd.)
pp. 21 - 25

EMD2008-118
A Study of Solder Connection Reliability in Cooling Design for Outdoor Telecommunications Equipment
Nobuhiro Tamayama, Shinya Hamagishi, Seiji Asai, Takeshi Tajiri, Osamu Kamimura (Hitachi Com Tech, Ltd.)
pp. 27 - 32

EMD2008-119
Manufacturing Technology for Embedded LSI(WLP) Substrates
Keisuke Okada (NEC Toppan Circuit Solutions. INC.)
pp. 33 - 37

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan