IEICE Technical Report

Print edition: ISSN 0913-5685      Online edition: ISSN 2432-6380

Volume 110, Number 298

Reliability

Workshop Date : 2010-11-19 / Issue Date : 2010-11-12

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Table of contents

R2010-32
Evaluation of degradation at a solder connected point due to electromigration
Akihiro Higuchi, Kazunori Hiraoka (Salesian Poly.)
pp. 1 - 4

R2010-33
Performance Degradation of Photovoltaic Modules with Rapid Thermal-Cycling
Yuichi Aoki, Manabu Okamoto (Espec Corp.), Atsushi Masuda, Takuya Doi (AIST)
pp. 5 - 8

R2010-34
The improvement of the sealing reliability of relays by the means of reducing permeability in sealing adhesives
Tomohiro Fukuhara, Mitsuo Ito, Osamu Otani (OMRON)
pp. 9 - 13

R2010-35
A Bootstrap Software Reliability Assessment Method in the Final Stage of Software Testing Process
Takaji Fujiwara (Biz3), Mitsuhiro Kimura (Hosei Univ.)
pp. 15 - 20

R2010-36
Inference of Reliability for Degradation Data Based on Stochastic Process Models
Toru Kaise (Univ. of Hyogo)
pp. 21 - 24

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan