Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380
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CPM2012-112
[Invited Talk]
High-Speed Interconnect Technologies
Yutaka Uematsu, Go Shinkai, Satoshi Muraoka, Masayoshi Yagyu, Hideki Osaka (Hitachi)
pp. 1 - 6
CPM2012-113
[Invited Talk]
Passive Intermodulation Observed in linearly designed circuits
Nobuhiro Kuga, Daijiro Ishibashi (Yokohama National Univ.)
pp. 7 - 10
CPM2012-114
[Invited Talk]
Expectations to 2.5D/3D Package and Challenges on Package Design
Hiroyuki Mori, Kazushige Toriyama, Yasumitsu Orii (IBM Japan)
pp. 11 - 14
CPM2012-115
[Invited Talk]
Overview of 3D Integration Technology and Challenges for Volume Production
Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.)
pp. 15 - 22
CPM2012-116
[Invited Talk]
Novel Packaging Design by Appling Metamaterial Structures
Takashi Harada, Hiroshi Toyao, Yoshiaki Kasahara (NEC Corp.)
pp. 23 - 28
CPM2012-117
[Keynote Address]
Dynamically Reconfigurable Processor (DRP) Technology: Current Status and Future Prospects
Masato Motomura (Hokkaido Univ.), Koichiro Furuta, Toru Awashima, Yasunari Shida (Renesas Electronics)
p. 29
CPM2012-118
Development of SoC Fast Electric Power Estimation System FPA2
Takayuki Sasaki (FUJITSU LAB.)
pp. 31 - 36
CPM2012-119
Signal Evaluation Circuit for BD Multi-layer Recording
Yusuke Nakamura, Hiroyuki Minemura, Takahiro Kurokawa, Taku Hoshizawa (Hitachi)
pp. 37 - 41
CPM2012-120
AES Cryptographic Circuit utilizing Dual-Rail RSL Memory Technique
Yuki Hashimoto, Mitsuru Shiozaki, Takaya Kubota, Takeshi Fujino (Ritsumeikan Univ.)
pp. 43 - 48
CPM2012-121
Chip Design and Performance evaluation of Via Programmable Analog Circuit
Keisuke Ueda, Ryo Nakazawa, Ryohei Hori, Mitsuru Shiozaki, Tomohiro Fujita, Takeshi Fujino (Ritsumeikan Univ.)
pp. 49 - 54
Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.