IEICE Technical Report

Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380

Reliability

Workshop Date : 2013-11-14 / Issue Date : 2013-11-07

R2013-74
Newest non-destructive X-ray inspection technology of conducting research and development and failure analysis -- It introduces from the foundation to application. --
Masahito Natsuhara (shimadzu)
pp. 1 - 3

R2013-75
Effective non-destructive defect localization by using Enhanced Lock-In Thermography
Toshinobu Nagatomo (DCG Systems)
pp. 5 - 9

R2013-76
Effect of Plate-Shape Ni-Sn IMC on the Growth Mechanism of Tin Whisker under Thermal Shock Stress
Akira Saito, Akira Okamoto, Yoshihiro Iwahori, Makoto Ogawa (Mutrata MFG), Akihiro Motoki (Sabae Mutrata MFG)
pp. 11 - 16

R2013-77
A Study on Sn-whisker growth by thermal cycle
Sadanori Itou (Itoken office)
pp. 17 - 20

R2013-78
Bayesian Reliability Analysis for Software Debugging Processes Based on Remaining Errors
Toru Kaise (Univ. of Hyogo)
pp. 21 - 24

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan