IEICE Technical Report

Print edition: ISSN 0913-5685      Online edition: ISSN 2432-6380

Volume 114, Number 469

Silicon Device and Materials

Workshop Date : 2015-03-02 / Issue Date : 2015-02-23

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Table of contents

SDM2014-162
[Invited Talk] Bio-MEMS towards Single-Molecular Characterization
Momoko Kumemura, Hiroyuki Fujita (Univ. of Tokyo)
pp. 1 - 5

SDM2014-163
[Invited Talk] Integration Technology of 3D FPGA with Performance Scalability and Function Flexibility
Kenichi Takeda, Mayu Aoki (Hitachi)
pp. 7 - 11

SDM2014-164
[Invited Talk] High-density and Athermal Silicon Optical Interposers for Inter-chip Interconnects
Takahiro Nakamura, Yutaka Urino (PETRA), Yasuhiko Arakawa (Univ. of Tokyo)
pp. 13 - 16

SDM2014-165
[Invited Talk] Formation of Epitaxial Metal/Gemanium Contacts and Control of Electric Conduction Property at the Interface
Osamu Nakatsuka, Yunsheng Deng, Akihiro Suzuki, Mitsuo Sakashita, Noriyuki Taoka, Shigeaki Zaima (Nagoya Univ.)
pp. 17 - 22

SDM2014-166
[Invited Talk] Area dependence of thermal stability factor in perpendicular STT-MRAM analized by bi-directional data flipping model
Koji Tsunoda, Masaki Aoki, Hideyuki Noshiro, Yoshihisa Iba, Chikako Yoshida, Yuuichi Yamazaki, Atsushi Takahashi, Akiyoshi Hatada, Masaaki Nakabayashi, Toshihiro Sugii (LEAP)
pp. 23 - 28

SDM2014-167
[Invited Talk] CNT Via Integration with Highly Dense and Selective CNT Growth
Atsunobu Isobayashi, Makoto Wada, Ban Ito, Tatsuro Saito, Daisuke Nishide, T. Ishikura, Masayuki Katagiri, Yuichi Yamazaki, Takashi Matsumoto, Masayuki Kitamura, Masahito Watanabe, Naoshi Sakuma, Akihiro Kajita, Tadashi Sakai (LEAP)
pp. 29 - 32

SDM2014-168
[Invited Talk] Effect of microtexture in electroplated copper thin-film interconnections on their migration resistance
Ken Suzuki, Takery Kato, Hideo Miura (Tohoku Univ)
pp. 33 - 38

SDM2014-169
[Invited Talk] Sub-nanoscale Structure and Barrier Performance of CVD-Cu(Mn)/ALD-Co(W) Interconnect System Proved Using 3D Atom Probe
Kohei Shima (The Univ. of Tokyo), Yuan Tu, Bin Han, Hisashi Takamizawa (Tohoku Univ.), Hideharu Shimizu (The Univ. of Tokyo), Yasuo Shimizu (Tohoku Univ.), Takeshi Momose (The Univ. of Tokyo), Koji Inoue, Yasuyoshi Nagai (Tohoku Univ.), Yukihiro Shimogaki (The Univ. of Tokyo)
pp. 39 - 44

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan