Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380
[TOP] | [2012] | [2013] | [2014] | [2015] | [2016] | [2017] | [2018] | [Japanese] / [English]
US2015-74
Focusing sound field by ultrasonic source combined circular vibrating plate with cylindrical rigid wall
Yuta Sibanai, Takuya Asami, Hikaru Miura (Nihon Univ.)
pp. 1 - 6
US2015-75
Non-contact method of stirring liquid using high-intensity aerial ultrasonic waves
Taichi Urakami, Ayumu Osumi, Youichi Ito (Nihon Univ.)
pp. 7 - 12
US2015-76
Non-contact heating of soft material surface by irradiation with high-intensity aerial ultrasonic waves
Hirotaka Sato, Ayumu Osumi, Youichi Ito (Nihon Univ.)
pp. 13 - 18
US2015-77
Ultrasonic complex vibration source consisted of longitudinal vibration and torsional vibration transducers
Takuya Asami, Hikaru Miura (Nihon Univ.)
pp. 19 - 22
US2015-78
Ultrasonic Welding Using a Long and Thin Complex Transverse Vibration Welding Tip with Vibration Detector and Static Pressure Controller
-- Ultrasonic Complex Vibration Welding of Deep and Narrow Positions --
Jiromaru Tsujino (Kanagawa Univ./ Asahi EMS)
pp. 23 - 28
US2015-79
Rediction Method for Residual Stress on Welded Joint Using Ultrasonic Vibrations
-- Comparison with Method Using Single Ultrasonic Vibration --
Shigeru Aoki, Katsumi Kurita (Tokyo Metro. Colle. Industrial Tech.), Shigeomi Koshimizu (Advanced Instit. of Indust. Tech)
pp. 29 - 32
US2015-80
Fundamental Study on Ultrasonic Welding of Small Machine Components
-- Investigation of shape of Welding Bead --
Masahiko Jin, Takuya Iizuka (NIT)
pp. 33 - 36
US2015-81
Prototype and its characteristics of cellular polypropylene microphone for ultrasound waves
Yusuke Toda, Tomoo Kamakura, Hideo Adachi, Hideyuki Nomura (UEC), Hideo Hayashi (KGK), Yosinobu Yasuno (Kobayasi-riken)
pp. 37 - 40
US2015-82
Displacement vector measurement using coherent superposition of plural steered plane wave transmissions and spectral frequency division
-- Agar phantom experiments --
Chikayoshi Sumi (Sophia Univ)
pp. 41 - 46
Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.