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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
WPT 2024-03-14
15:35		 Kyoto Kyoto-Univ. (Uji campus)
(Primary: On-site, Secondary: Online)		 MIM Tunnel Diode using Self-Assembled Pt Nanoparticles for Wireless Power Harvesting in Terahertz
Zhen Liu, Makoto Shimizu, Shunsuke Abe, Hiroo Yugami (Tohoku Univ.) WPT2023-43		  [more] WPT2023-43
pp.43-48
MW 2012-10-18
13:05		 Tochigi Utsunomiya Univ. Electromagnetic Analysis and Measurement of a Spiral Inductor and capacitor on a Silicon CMOS Substrate in the Millimeter-wave Band
Takashi Sumida, Takuichi Hirano, Kenichi Okada, Jiro Hirokawa, Makoto Ando (Titech) MW2012-89		 The electromagnetic (EM) modeling and EM simulation technique are discussed for an on-chip spiral inductor and a MIM cap... [more] MW2012-89
pp.47-52
MW, ED 2011-01-14
13:50		 Tokyo Kikai-Shinko-Kaikan Bldg. New Stacked Metal-Insulator-Metal Capacitor for future InP-based ICs Applications
Takuya Tsutsumi, Suehiro Sugitani, Kazumi Nishimura, Minoru Ida (NTT) ED2010-189 MW2010-149		 Increasing the capacitance density would be a very effective way of making InP IC chips smaller because capacitors occup... [more] ED2010-189 MW2010-149
pp.75-80
ICD 2008-04-17
13:05		 Tokyo   [Invited Talk] Embedded DRAM Technology for Consumer Electronics
Hiroki Shirai, Ryousuke Ishikawa, Yuichi Itoh, Takuya Kitamura, Mami Takeuchi, Takashi Sakoh, Ken Inoue, Tohru Kawasaki, Nobuyuki Katsuki, Hiroyuki Hoshizaki, Shinichi Kuwabara, Hidetaka Natsume, Masato Sakao, Takaho Tanigawa (NEC Electronics) ICD2008-4		 This paper presents embedded DRAM device technology utilizing stacked MIM(Metal-Insulator-Metal) capacitor. Targeted for... [more] ICD2008-4
pp.19-24
ICD 2007-04-12
10:40		 Oita   Device Technology for embedded DRAM utilizing stacked MIM(Metal-Insulator-Metal) Capacitor
Takaho Tanigawa, Yasushi Yamagata, Hiroki Shirai, Hirotoshi Sugimura, Tomoko Wake, Ken Inoue, Takashi Sakoh, Masato Sakao (NECEL) ICD2007-4		 This paper presents embedded DRAM device technology utilizing stacked MIM(Metal-Insulator-Metal) capacitor. Targeted for... [more] ICD2007-4
pp.17-22
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