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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 9 of 9  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
DC 2022-12-16
13:10
Yamaguchi
(Primary: On-site, Secondary: Online)
On Improving the Accuracy of LSI Small Delay Fault Diagnosis
Shinnosuke Fujita, Stefan Holst, Xiaoqing Wen (Kyutech) DC2022-72
With today's tight timing margins, increasing manufacturing variation, and the development of nanometer technology, timi... [more] DC2022-72
pp.1-6
VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC
(Joint) [detail]
2018-12-06
13:00
Hiroshima Satellite Campus Hiroshima Test Time Reduction by Separating Delay Lines in Boundary Scan Circuit with Embedded TDC
Satoshi Hirai, Hiroyuki Yotsuyanagi, Masaki Hashizume (Tokushima Univ.) VLD2018-56 DC2018-42
3D die-stacking technique using TSVs has gained much attention as a new integration method of IC.
However, faulty TSVs ... [more]
VLD2018-56 DC2018-42
pp.119-124
VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC
(Joint) [detail]
2018-12-06
13:50
Hiroshima Satellite Campus Hiroshima Study on the Applicability of ATPG Pattern for DFT Circuit
Kohki Taniguchi, Hiroyuki Yotsuyanagi, Masaki Hashizume (Tokushima Univ.) VLD2018-58 DC2018-44
With high integration of IC, small delay faults have occurred as the cause of a circuit failure. As a design-for-testabi... [more] VLD2018-58 DC2018-44
pp.131-136
DC 2018-02-20
10:35
Tokyo Kikai-Shinko-Kaikan Bldg. Reduction of Wire Length by Reordering Delay Elements in Boundary Scan Circuit with Embedded TDC
Satoshi Hirai, Hiroyuki Yotsuyanagi, Masaki Hashizume (Tokushima Univ.) DC2017-79
TSV attracts attention as a new implementation method of interconnects between dies in 3DICs.
However, faulty TSVs may ... [more]
DC2017-79
pp.13-18
VLD, DC, CPSY, RECONF, CPM, ICD, IE
(Joint) [detail]
2016-11-30
09:25
Osaka Ritsumeikan University, Osaka Ibaraki Campus Design of TDC Embedded in Scan FFs for Testing Small Delay Faults
Shingo Kawatsuka, Hiroyuki Yotsuyanagi, Masaki Hashizume (Tokushima Univ.) VLD2016-62 DC2016-56
With improvement of semiconductor manufacturing process, small delay becomes more important cause of timing failures.
... [more]
VLD2016-62 DC2016-56
pp.105-110
DC, CPSY 2013-04-26
16:40
Tokyo   On-Chip Delay Measurement Using Adjacent Test Architecture
Kentaroh Katoh (TNCT) CPSY2013-8 DC2013-8
This paper proposes an on-chip delay measurement using adjacent test architecture with TDC (Time to Digital Converter). ... [more] CPSY2013-8 DC2013-8
pp.43-48
DC 2012-06-22
13:00
Tokyo Room B3-1 Kikai-Shinko-Kaikan Bldg An evaluation of a don't care filling method to improve fault sensitization coverage
Ryosuke Wakasugi, Toshinori Hosokawa (Nihon Univ), Masayoshi Yoshimura (Kyusyu Univ) DC2012-9
A single stuck-at fault model and a transition fault model have been widely used to generate test patterns for VLSIs. Ho... [more] DC2012-9
pp.1-6
DC 2011-02-14
11:00
Tokyo Kikai-Shinko-Kaikan Bldg. An Analysis of Critical Paths for Field Testing with Process Variation Consideration
Satoshi Kashiwazaki, Toshinori Hosokawa (Nihon Univ), Masayoshi Yoshimura (Kyushuu Univ) DC2010-61
Recently, it has the problem that good VLSIs in production testing become defective VLSIs in the fields because small de... [more] DC2010-61
pp.13-19
DC 2010-02-15
13:20
Tokyo Kikai-Shinko-Kaikan Bldg. Reduction of execution times and areas for delay measurement by subtraction
Toru Tanabe, Hirohisa Minato, Kentaroh Katoh, Kazuteru Namba, Hideo Ito (Chiba Univ.) DC2009-71
Since VLSI is in nanoscase size, high density and high speed in recent years, small-delay defects which change propagati... [more] DC2009-71
pp.39-44
 Results 1 - 9 of 9  /   
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