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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2019-02-07
11:25		 Tokyo   [Invited Talk] Ultrafine 3D Interconnect Technology Using Directed Self-Assembly
Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi (Tohoku Univ.) SDM2018-92		 A directed self-assembly (DSA) technology is applied to fabricate ultrafine pitch TSV (Through-Silicon Vias) for ultra-h... [more] SDM2018-92
pp.5-8
EMCJ, IEE-EMC, IEE-MAG 2018-11-22
14:20		 Overseas KAIST A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation with N-level on Stacked Through Silicon Vias
Junyong Park, Youngwoo Kim, Kyungjun Cho, Seongsoo Lee, Joungho Kim (KAIST) EMCJ2018-64		 This paper proposed an eye-diagram estimation method for pulse amplitude modulation with N-level signaling. For verifica... [more] EMCJ2018-64
p.29
EMCJ, IEE-EMC, IEE-MAG 2016-06-02
16:10		 Overseas NTU, Taiwan [Invited Talk] Modeling and Measuring Vertical Interconnects with Impedance Control Over a Wide Frequency Range
Kuan-Chung Lu, Tzyy-Sheng Horng (National Sun Yat-sen Univ.) EMCJ2016-35		 The advantages of vertical interconnects include superior electrical transmissions for stacked dies, higher I/O density,... [more] EMCJ2016-35
pp.57-62
CPM 2010-07-30
09:30		 Hokkaido Michino-Eki Shari Meeting Room Low temperature of deposition of ZrNx film using radical reaction
Masaru Sato, Mayumi B. Takeyama (kitami Inst. of Tech.), Yuichiro Hayasaka, Eiji Aoyagi (Tohoku Univ.), Atsushi Noya (kitami Inst. of Tech.) CPM2010-36		 Recently, an increase in the integration density of the Si-ULSI system is realized in the 3-D packaging
technology. A t... [more]		 CPM2010-36
pp.29-34
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