Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380
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EMCJ2014-10
Side-Channel Leakage on Silicon Substrate of CMOS Cryptographic Chip
Daisuke Fujimoto, Noriyuki Miura, Makoto Nagata (Kobe Univ.), Yu-ichi Hayashi, Naofumi Homma (Tohoku Univ.), Shivam Bhasin, Jean-Luc Danger (Telecom Paristech)
pp. 1 - 6
EMCJ2014-11
Identification Method of Fault-injected Timing on Cryptographic Devices Using Side-channel Information
Ko Nakamaura, Yu-ichi Hayashi, Takaaki Mizuki, Naofumi Homma, Takafumi Aoki, Hideaki Sone (Tohoku Univ.)
pp. 7 - 12
EMCJ2014-12
Investigation on Aes Circuites in Information-Leaking-Behavior by Means of Internal Equivalent Current Source
Nobuhiro Tai, Kengo Iokibe, Hiroto Kagotani, Hiroyuki Onishi, Kazuhiro Maeshima, Yoshitaka Toyota (Okayama Univ.), Tetsushi Watanabe (Industrial Technology Center of Okayama Prefecture)
pp. 13 - 18
EMCJ2014-13
Induction characteristics of power line models with no branch and outlet branch from surrounding magnetic field
-- Experimental Discussion by Using Open Area Test Site --
Masamitsu Tokuda (Univ. of Tokyo), Chiharu Miyazaki, Yuichi Sasaki (Mitsubishi Electric), Katsuyuki Tanakajima (Intertek), Hiroyuki Ohsaki (Univ. of Tokyo)
pp. 19 - 24
EMCJ2014-14
A Fundamental Study on Derivation of EMI from Through Silicon Vias (TSV)
Masashi Kawakami, Kenji Hashimoto (UEC), Kimitoshi Murano (Tokai Univ.), Yoshio Kami, Fengchao Xiao (UEC)
pp. 25 - 30
EMCJ2014-15
Realistic Modeling of Japanese Standard Heads using Volume Morphing Technique
Tomoaki Nagaoka, Kanako Wake (NICT), Masao Taki (Tokyo Metropolitan Univ.), Soichi Watanabe (NICT)
pp. 31 - 34
EMCJ2014-16
Analysis of Conductive and Inductive Noise Couplings on TEG Chip with Magnetic Thin Film
Sho Muroga, Fan Peng, Satoshi Tanaka (Tohoku Univ.), Tomomitsu Kitamura (Renesas SP Drivers), Hiroaki Matsui (Renesaselectronics), Naoya Azuma, Shunsuke Shimazaki, Junpei Kosaka, Makoto Nagata (Kobe Univ.), Masahiro Yamaguchi (Tohoku Univ.)
pp. 55 - 58
Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.