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Technical Committee on Electromagnetic Compatibility (EMCJ) (Searched in: 2014)
Search Results: Keywords 'from:2014-06-20 to:2014-06-20'
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| EMCJ, IEE-EMC | 2014-06-20 10:35 |
Hyogo | Kobe Univ. | Side-Channel Leakage on Silicon Substrate of CMOS Cryptographic Chip Daisuke Fujimoto, Noriyuki Miura, Makoto Nagata (Kobe Univ.), Yu-ichi Hayashi, Naofumi Homma (Tohoku Univ.), Shivam Bhasin, Jean-Luc Danger (Telecom Paristech)  EMCJ2014-10 |
Power supply currents of CMOS digital circuits partly flow through a silicon substrate in their returning (ground) paths... [more] | EMCJ2014-10 pp.1-6 |
| EMCJ, IEE-EMC | 2014-06-20 11:00 |
Hyogo | Kobe Univ. | Identification Method of Fault-injected Timing on Cryptographic Devices Using Side-channel Information Ko Nakamaura, Yu-ichi Hayashi, Takaaki Mizuki, Naofumi Homma, Takafumi Aoki, Hideaki Sone (Tohoku Univ.) EMCJ2014-11 |
This paper describes a new technique to choose faulty ciphertexts available for Differential Fault Analysis (DFA) from t... [more] | EMCJ2014-11 pp.7-12 |
| EMCJ, IEE-EMC | 2014-06-20 11:25 |
Hyogo | Kobe Univ. | Investigation on Aes Circuites in Information-Leaking-Behavior by Means of Internal Equivalent Current Source Nobuhiro Tai, Kengo Iokibe, Hiroto Kagotani, Hiroyuki Onishi, Kazuhiro Maeshima, Yoshitaka Toyota (Okayama Univ.), Tetsushi Watanabe (Industrial Technology Center of Okayama Prefecture) EMCJ2014-12 |
[more] | EMCJ2014-12 pp.13-18 |
| EMCJ, IEE-EMC | 2014-06-20 13:00 |
Hyogo | Kobe Univ. | Induction characteristics of power line models with no branch and outlet branch from surrounding magnetic field
-- Experimental Discussion by Using Open Area Test Site -- Masamitsu Tokuda (Univ. of Tokyo), Chiharu Miyazaki, Yuichi Sasaki (Mitsubishi Electric), Katsuyuki Tanakajima (Intertek), Hiroyuki Ohsaki (Univ. of Tokyo) EMCJ2014-13 |
A high speed power line communication system using high frequency band may decrease its transmission speed due to distur... [more] | EMCJ2014-13 pp.19-24 |
| EMCJ, IEE-EMC | 2014-06-20 13:25 |
Hyogo | Kobe Univ. | A Fundamental Study on Derivation of EMI from Through Silicon Vias (TSV) Masashi Kawakami, Kenji Hashimoto (UEC), Kimitoshi Murano (Tokai Univ.), Yoshio Kami, Fengchao Xiao (UEC) EMCJ2014-14 |
In recent years, through-silicon via (TSV) technology has attracted attention in the field of 3D packaging technology. ... [more] |
EMCJ2014-14 pp.25-30 |
| EMCJ, IEE-EMC | 2014-06-20 13:50 |
Hyogo | Kobe Univ. | Realistic Modeling of Japanese Standard Heads using Volume Morphing Technique Tomoaki Nagaoka, Kanako Wake (NICT), Masao Taki (Tokyo Metropolitan Univ.), Soichi Watanabe (NICT) EMCJ2014-15 |
[more] | EMCJ2014-15 pp.31-34 |
| EMCJ, IEE-EMC | 2014-06-20 15:45 |
Hyogo | Kobe Univ. | Analysis of Conductive and Inductive Noise Couplings on TEG Chip with Magnetic Thin Film Sho Muroga, Fan Peng, Satoshi Tanaka (Tohoku Univ.), Tomomitsu Kitamura (Renesas SP Drivers), Hiroaki Matsui (Renesaselectronics), Naoya Azuma, Shunsuke Shimazaki, Junpei Kosaka, Makoto Nagata (Kobe Univ.), Masahiro Yamaguchi (Tohoku Univ.) EMCJ2014-16 |
[more] | EMCJ2014-16 pp.55-58 |
| EMCJ, IEE-EMC | 2014-06-20 16:15 |
Hyogo | Kobe Univ. | [Special Talk]
On the occasion of completion of the K computer devleopment project Mitsuo Yokokawa (Kobe Univ.) |
[more] | |
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