IEICE Technical Committee Submission System
Conference Schedule		 Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 4 of 4  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
ED 2017-04-20
16:15		 Miyagi   Surface plasma treatment of reverse-offset-printed electrodes for organic thin-film transistors
Gaku Tsuburaoka, Yasunori Takeda (Yamagata Univ.), Tomoko Okamoto (DIC corpo.), Yoshinori Katayama (DIC Corpo.), Takashi Fukuda (Tosoh Corp.), Daisuke Kumaki, Hiroyuki Matsui, Konami Izumi, Shizuo Tokito (Yamagata Univ.) ED2017-7		 Printing high resolution electrodes is an important technology for realizing the high integration of sensing devices and... [more] ED2017-7
pp.25-28
SDM, ED
(Workshop)		 2012-06-28
10:40		 Okinawa Okinawa Seinen-kaikan [Poster Presentation] Mold transfer processed organic light emitting diodes using patterned conductive polymer electrode
Hyun Jun Lee, Young Wook Park, Tae Hyun Park, Eun Ho Song (Korea Univ.), Se Joong Shin (Korea univ.), Hakkoo Kim, Kyung bok Choi, Ju Hyun Hwang (Korea Univ.), Jinwoo Lee (Micobiomed. Ltd), Jinnil Choi (Hanbat National Univ.), Byeong-Kwon Ju (Korea Univ.) 		We fabricated OLEDs with a micro patterned flexible polymer transparent conductive electrode by the mold transfer proces... [more]
SDM 2012-03-05
14:00		 Tokyo Kikai-Shinko-Kaikan Bldg. Evaluation of additives effects in copper electroplating solution by rapid exchange using microfluidic reactor
Takeyasu Saito, Yutaka Miyamoto, Sunao Hattori, Naoki Okamoto, Kazuo Kondo (Osaka Prefecture Univ.) SDM2011-181		 The adsorption behaviour of additives during copper electrodeposition was investigated by the microfluidic reactor. We ... [more] SDM2011-181
pp.31-35
OME 2009-01-21
15:15		 Aichi Ｎａｇｏｙａ Ｕｎｉｖ． A new low temperature vulcanized silicone compound
Yasunori Ashida, Shinya Kitamura, Hiroaki Cho, Shuhei Nakamura (Mie Univ), Wataru Shimizu, Yasushi Murakami (Shinshu Univ) OME2008-91		 Room temperature vulcanized silicone compounds are usually made by using metal additives such as tin compound and their ... [more] OME2008-91
pp.49-54
 Results 1 - 4 of 4  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan