IEICE Technical Report

Online edition: ISSN 2432-6380

Volume 121, Number 366

Silicon Device and Materials

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Table of contents

SDM2021-74
[Invited Talk] Quantitative evaluation on barrier property of ultra-thin PVD-Co(W) films using lag-time method
Takeshi Momose, Taewoong Kim, Yubin Deng, Momoko Deura (UTokyo), Akira Matsuo, Nobuo Yamaguchi (CANON ANELVA), Yukihiro Shimogaki (UTokyo)
pp. 1 - 4

SDM2021-75
[Invited Talk] Advanced Damascene Integration with Self Assembled Monolayer (SAM)
Hiroyuki Nagai, Mitsuaki Iwashita, Yuki Kikuchi (TEL), Kawasaki Hiroaki, Gyana Pattanaik (TTCA), Keiichi Fujita (TKL), Kazutoshi Iwai (TEA), Hiroyuki Komatsu, Yuuki Ozaki (JSR)
pp. 5 - 8

SDM2021-76
[Invited Talk] Printed Electronics using low-temperature catalyzed solution-processed SiO2
Takeo Minari (NIMS), Qingqing Sun (Zhengzhou Univ.), Lingying Li (NIMS), Wanli Li (Jiangnan Univ.), Xuying Liu (Zhengzhou Univ.)
pp. 9 - 12

SDM2021-77
[Invited Talk] 3D Sequential Process Integration for CMOS Image Sensor
Keiichi Nakazawa, Junpei Yamamoto, Nobutoshi Fujii, Mutsuo Uehara, Katsunori Hiramatsu, Hideomi Kumano, Shigetaka Mori, Shintaro Okamoto, Akito Shimizu, Koichi Baba, Hidetoshi Onuma, Akira Matsumoto, Koichiro Zaitsu, Keiji Tanani, Tomoyuki Hirano, Hayato Iwamoto (Sony Semiconductor Solutions)
pp. 13 - 16

SDM2021-78
[Invited Talk] Superconducting Quantum Computers -- Scalable wiring architecture --
Yutaka Tabuchi (RIKEN)
pp. 17 - 20

SDM2021-79
[Invited Talk] 3D Integration Technology for Quantum Computer based on Diamond Spin Qubits
Ryoichi Ishihara, Jeffrel Hermias, Shuichang Yu, King Y. Yu, Ye Li, Maurice van der Maas, Salahuddin Nur (TUDelft), Toshiki Iwai, Tetsuya Miyatake, Kenichi Kawaguchi, Yoshiyasu Doi, Shintaro Sato (Fujitsu)
pp. 21 - 26

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.