Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
AP (2nd) |
2021-12-02 10:10 |
Okinawa |
Miyakojima (Primary: On-site, Secondary: Online) |
Imaging of Electromagnetic-Waves using RoF System Based on Si Photonics Microring Modulator Array Liucun Li, Hiroyuki Arai, Toshihiko Baba (Yokohama Nat'l Univ.) |
We propose an electromagnetic wave imaging radio over fiber system that connects an RF probe sensor array with a microri... [more] |
|
LQE, OPE, SIPH |
2018-12-06 17:10 |
Tokyo |
Keio University |
High optical coupling efficiency by double taper-type coupler structure towards III-V/Si hybrid photonic integration Takehiko Kikuchi (SEI/Tokyo Tech.), Junichi Suzuki, Fumihito Tachibana (Tokyo Tech.), Naoko Inoue, Hideki Yagi (SEI), Moataz Eissa, Takuya Mitarai, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai (Tokyo Tech.) OPE2018-129 LQE2018-139 SIPH2018-45 |
The hybrid integration utilizing III-V based active devices with Si-Photonics is very attractive to realize new-generati... [more] |
OPE2018-129 LQE2018-139 SIPH2018-45 pp.161-164 |
EMT, EST, LQE, MWP, OPE, PEM, PN, IEE-EMT [detail] |
2018-01-26 09:30 |
Hyogo |
|
On-chip autocorrelator using Si photonics waveguides with two-photon-absorption PD array Keisuke Kondo (Tokyo Tech/Yokohama Nat'l Univ.), Toshihiko Baba (Yokohama Nat'l Univ.) PN2017-83 EMT2017-120 OPE2017-161 LQE2017-143 EST2017-119 MWP2017-96 |
(To be available after the conference date) [more] |
PN2017-83 EMT2017-120 OPE2017-161 LQE2017-143 EST2017-119 MWP2017-96 pp.263-268 |
OPE |
2017-12-07 15:00 |
Okinawa |
|
[Memorial Lecture]
Toward realizing large-scale optical integrated circuit Hirohito Yamada (Tohoku Univ.) OPE2017-111 |
I describe my former studies including dry etching of compound semiconductor materials for forming LD optical cavity and... [more] |
OPE2017-111 pp.111-114 |
SDM |
2016-01-28 14:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
[Invited Talk]
CMOS photonics technologies based on heterogeneous integration on Si Mitsuru Takenaka, Younghyun Kim, Jaehoon Han, Jian Kan, Yuki Ikku, Yongpeng Cheng, Jinkwon Park, SangHyeon Kim, Shinichi Takagi (Univ. of Tokyo) SDM2015-124 |
In this paper, we present heterogeneous integration of SiGe/Ge and III-V semiconductors on Si for electronic-photonic in... [more] |
SDM2015-124 pp.17-20 |
CPM, OPE, LQE, R, EMD |
2015-08-28 14:25 |
Aomori |
Aomori-Bussankan-Asupamu |
Optical I/O Structure with Wide Allowable Displacement for Miniaturized Si Photonic Optical Transceivers Toshinori Uemura, Akio Ukita, Koichi Takemura, Mitsuru Kurihara, Daisuke Okamoto, Jun Ushida, Kenichiro Yashiki, Kazuhiko Kurata (PETRA) R2015-45 EMD2015-53 CPM2015-69 OPE2015-84 LQE2015-53 |
We have developed an optical I/O structure using an array of optical pins for a chip-scale parallel optical module named... [more] |
R2015-45 EMD2015-53 CPM2015-69 OPE2015-84 LQE2015-53 pp.109-114 |
NS, OCS, PN (Joint) |
2015-06-19 14:15 |
Fukui |
Fukui-shi-chiiki-kouryu |
5 mW/Gbps hybrid-integrated Si-photonics based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF Daisuke Okamoto, Kenichiro Yashiki, Yasuyuki Suzuki, Ichiro Ogura, Kazuhiko Kurata (PETRA) OCS2015-21 |
We have developed 5 × 5 mm2 silicon-photonic chip-scale optical transmitters/receivers called “optical I/O cores”. The t... [more] |
OCS2015-21 pp.55-58 |
EMD, LQE, OPE, CPM, R |
2014-08-22 14:25 |
Hokkaido |
Otaru Economy Center |
Opto-electronic hybrid integrated chip packaging technology for silicon photonic platform using gold-stud bump bonding Mitsuo Usui, Kotaro Takeda, Hirooki Hirata, Hiroshi Fukuda, Tai Tsuchizawa, Hidetaka Nishi, Rai Kou, Tatsuro Hiraki, Kentaro Honda, Masafumi Nogawa, Koji Yamada, Tsuyoshi Yamamoto (NTT) R2014-45 EMD2014-50 CPM2014-65 OPE2014-75 LQE2014-49 |
We propose a new solder-free and low-temperature (200 ℃ or less) flip-chip integration technology for silicon photonic p... [more] |
R2014-45 EMD2014-50 CPM2014-65 OPE2014-75 LQE2014-49 pp.109-114 |
OCS, PN, NS (Joint) |
2013-06-21 13:45 |
Fukushima |
College of Engineering, Nihon University |
Development of a scalable transponder aggregator prototype by highly integrated optical switches based on Si photonics technology Hitoshi Takeshita, Tomoyuki Hino, Shigeru Nakamura, Akio Tajima (NEC), Kiyo Ishii, Junya Kurumida, Shu Namiki (AIST) OCS2013-17 |
We have developed highly integrated optical switches based on Si photonics technology in order to enlarge capacity and r... [more] |
OCS2013-17 pp.37-42 |
OPE, EMT, LQE, PN, IEE-EMT [detail] |
2011-01-27 16:35 |
Osaka |
Osaka Univ. |
Slow Light Tunable Delay Line and High-Speed Optical Pulse Train Generator in Si Photonics Fumihiro Shinobu, Yoshiki Arita, Takemasa Tamanuki, Hong C. Nguyen, Keijiro Suzuki, Norihiro Ishikura, Mizuki Shinkawa, Ryo Hayakawa, Toshihiko Baba (Yokohama Nat'l Univ.) PN2010-38 OPE2010-151 LQE2010-136 |
We propose and demonstrate ring all pass filter type slow light tunable delay line. The device was fabricated by using S... [more] |
PN2010-38 OPE2010-151 LQE2010-136 pp.63-68 |
OPE |
2010-12-17 17:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The characteristics of GaInAsP wired waveguide on Si substrate with BCB bonding Yasuna Maeda, Jieun Lee, Yuki Atsumi, Nobuhiko Nishiyama, Shigehisa Arai (Tokyo Tech) OPE2010-141 |
To overcome LSI performance limitation due to the global electrical wiring of LSIs, the realization of the ultra-low-po... [more] |
OPE2010-141 pp.55-60 |
OPE |
2008-12-19 15:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
InGaAs MSM waveguide-photodetector integrated on Si wire Kazuya Ohira, Nobuo Suzuki, Mizunori Ezaki (Toshiba) OPE2008-142 |
InGaAs MSM waveguide-photodetector is proposed and its fundamental device characteristics are reported. InGaAs absorptio... [more] |
OPE2008-142 pp.31-33 |