Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
RCS, CCS, SR, SRW (Joint) |
2016-03-02 14:05 |
Tokyo |
Tokyo Institute of Technology |
[Invited Lecture]
RFIC solutions to enable Internet of Things Sonryo Kim (TI) SRW2015-79 |
Sensor Network is an essential part of Internet of Things and RFIC is crucial part of Sensor Network. Introduce the tech... [more] |
SRW2015-79 pp.51-56 |
ICD, ITE-IST |
2013-07-04 15:30 |
Hokkaido |
San Refre Hakodate |
[Invited Talk]
Introduction of the application by using analog peripherals of the ultra-low power MCU MSP430 Yoshihide Iwata, Hitoshi Sugawara (TIJ) ICD2013-31 |
[more] |
ICD2013-31 pp.37-42 |
ICD, ITE-IST |
2013-07-04 17:10 |
Hokkaido |
San Refre Hakodate |
[Panel Discussion]
Extending analog-interface function increasingly for micro computer Toshihiko Hamasaki (HIT), Yoshihisa Homma (Panasonic), Hideaki Ishihara (Denso), Yoshihide Iwata (TIJ), Masanori Hayashikoshi (Renesas), Mitsuhiko Noda (Lapis), Yoshiyasu Doi (Fujitsu Lab.) ICD2013-33 |
(To be available after the conference date) [more] |
ICD2013-33 p.49 |
ICD, ITE-IST |
2012-07-26 13:30 |
Yamagata |
Yamagata University |
[Invited Talk]
Advancing of control method of DC-DC converter for low voltage and fast load transient of LSI
-- From linear control to non-linear control -- Toshiyuki Zaitsu (Texas Instruments Japan) ICD2012-22 |
[more] |
ICD2012-22 pp.19-24 |
SDM |
2010-11-12 14:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Modeling of 2D Bias Control in Overlap Region of High-Voltage MOSFETs Akihiro Tanaka, Yasunori Oritsuki, Hideyuki Kikuchihara, Masataka Miyake, Hans Juergen Mattausch, Mitiko Miura-Mattausch (Hiroshima Univ.), Yong Liu, Keith Green (TI) SDM2010-181 |
High-voltage MOSFETs have been applied in a wide range of bias voltages from a few volts up to several hundred volts by ... [more] |
SDM2010-181 pp.53-57 |
EE, IEE-SPC |
2010-07-30 16:05 |
Kochi |
Kochi National College of Technology |
Frequency Domain Analysis of Fixed On-Time with Bottom Detection Controlled Converter Toshiyuki Zaitsu (TI Japan), Terukazu Sato, Takashi Nabeshima (Oita Univ.) EE2010-15 |
[more] |
EE2010-15 pp.117-120 |
EE |
2010-01-21 16:40 |
Fukuoka |
|
Dynamic Response Improvement of Digitally Controlled DC-DC Converter with PZC Control Seiya Abe, Mariko Ogawa (Kyushu Univ.), Toshiyuki Zaitsu, Satoshi Obata (Texas Instruments Japan Ltd), Masahito Shoyama (Kyushu Univ.), Tamotsu Ninomiya (Nagasaki Univ.) EE2009-40 |
[more] |
EE2009-40 pp.25-30 |
ICD, IPSJ-ARC, IPSJ-EMB |
2009-01-13 10:30 |
Osaka |
Shoushin Kaikan |
[Invited Talk]
Evolution of application processor OMAP for mobile products Masahiro Miyazaki (Texas Inst. Japan Limited) ICD2008-131 |
Abstract This presentation shows the evolution of application processor OMAP. Recently, high performance multimedia and ... [more] |
ICD2008-131 pp.13-17 |
ICD, IPSJ-ARC, IPSJ-EMB |
2009-01-13 15:45 |
Osaka |
Shoushin Kaikan |
[Panel Discussion]
Past and Future of Platform-based Designs Kazuaki Murakami (Kyushu Univ.), Akihito Iwai (DENSO), Kazuo Kajimoto (Panasonic), Takayuki Sugawara (Tensilica K.K.), Masahiro Miyazaki (Texas Inst. Japan Limited) ICD2008-135 |
(To be available after the conference date) [more] |
ICD2008-135 p.37 |
ICD, ITE-IST |
2008-10-23 15:00 |
Hokkaido |
Hokkaido University |
[Invited Talk]
Direction for High Performance Analog Circuit Integration Toshihiko Hamasaki (Texas Instruments) ICD2008-77 |
Abstract Advanced CMOS technology beyond 90nm is leading power reduction trend in analog digital mixed signal circuitry... [more] |
ICD2008-77 pp.107-112 |
CPM, ICD |
2008-01-18 14:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Assessment Test for Solder Joint Reliability in Mobile Products Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155 |
When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] |
CPM2007-144 ICD2007-155 pp.93-98 |
SIP, ICD, IE, IPSJ-SLDM (Joint) [detail] |
2007-10-25 15:15 |
Fukushima |
Aidu-Higasiyama-Onsen Kuturogijuku |
[Invited Talk]
Present situation and future perspective of video codec using DSP Tomoyuki Naito (TI Japan) |
[more] |
|
ICD, CPM |
2007-01-19 09:50 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Modeling of Wire Bonding Process for High Performance Device Eiichi Yamada, Masazumi Amagai (TI Japan) |
[more] |
CPM2006-143 ICD2006-185 pp.83-86 |
ICD, CPM |
2007-01-19 10:15 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Signal Transmission Guideline in IC Package Kentaro Takao, Chikara Azuma, Masazumi Amagai (TIJ) |
[more] |
CPM2006-144 ICD2006-186 pp.87-90 |
ICD |
2006-05-26 10:30 |
Hyogo |
Kobe University |
A Digital Input Controller for Audio Class-D Amplifiers with 100W 0.004% THD+N and 113dB DR Toru Ido, Sonny Ishizuka (TIJ), Lars Risbo (TIDK), Fumitaka Aoyagi, Toshihiko Hamasaki (TIJ) |
[more] |
ICD2006-30 pp.49-54 |
RCS, AP, WBS, SR, MW, MoNA (Joint) |
2006-03-02 09:50 |
Kanagawa |
YRP |
[Invited Talk]
Detection-and-Avoidance(DAA) Technology for UWB
-- Challenges to share the frequency resource -- Hirohisa Yamaguchi (Texas Instruments Japan) |
Aim and performance of DAA is overviewed. Both detection and mitigation are discussed. Simulation result is shown to dem... [more] |
WBS2005-76 SR2005-68 pp.11-18 |
ICD, CPM |
2005-09-08 13:50 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of Silicon Stress for Stacked Die Packages Kenji Abe, Eiichi Yamada, Yutaka Suzuki, Masazumi Amagai (TI Japan) |
[more] |
CPM2005-92 ICD2005-102 pp.41-44 |
ICD, CPM |
2005-09-08 14:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of Stress Sensor for Stacked Die Packages Yutaka Suzuki, Kenji Abe, Eiichi Yamada, , Masazumi Amagai (TI Japan) |
[more] |
CPM2005-93 ICD2005-103 pp.45-48 |
ICD, SDM |
2005-08-19 09:20 |
Hokkaido |
HAKODATE KOKUSAI HOTEL |
A 106dB audio digital-to-analog converter employing segment flipping technology combined with cascaded dynamic element matching Toru Ido, Sonny Ishizuka (TIJ) |
A 106dB stereo audio digital-to-analog converter having high power supply rejection and reduced jitter
sensitivity usin... [more] |
SDM2005-145 ICD2005-84 pp.13-18 |
ICD, CPM |
2005-01-27 16:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of An-Ag-X Lead Free Solders for High Reliability Masazumi Amagai (TI Japan), Tsukasa Ohnishi, (SMI) |
[more] |
CPM2004-161 ICD2004-206 pp.35-38 |